Full Site - : baking out mositure (Page 12 of 45)

Baking prior to conformal coat

Electronics Forum | Wed Jul 20 10:07:05 EDT 2005 | cecil

Does anyone have any input on the need to bake out an assembly prior to the conformal coat process? I understand baking out components/pwb's prior to processing through the reflow or wave solder process if the material shows excess moisture absorbtio

Military Lamina bake-out

Electronics Forum | Fri Aug 02 12:31:51 EDT 2002 | QuadTweeker1

What are some of the guidelines used by Industry professionals for all Lamina materials and layers?

BGA bake out....

Electronics Forum | Mon Jun 28 15:03:43 EDT 2004 | jdumont

If you dont mind me asking, what are you guys using to keep your IC's dry??

BGA bake out....

Electronics Forum | Mon Jun 28 15:11:29 EDT 2004 | davef

McDry seems be a good unit to consider.

Parylene coating - spots defect around via holes & other flat surface

Electronics Forum | Fri Oct 07 08:48:45 EDT 2016 | davef

Two things ... A friend in the contract coating business said: "... the board is not being baked out long enough, 30 min is certainly not long enough depending on how many layers this board is, as the vacuum (from the parylene process) is pulling t

Electronic Assemblies Manufactuirng - Bake-out ramp rate

Electronics Forum | Mon May 21 11:09:30 EDT 2018 | optimatech

Thank You for informing me :)

LGA voiding

Electronics Forum | Tue Jan 07 17:33:26 EST 2020 | SMTA-Norah

Were the boards baked out before soldering? Is there plated over vias in the pads?

dry oven

Electronics Forum | Tue Aug 06 08:54:21 EDT 2002 | mike

I have two basic questions: 1. We have a number of small convection ovens and want to modify some of these for baking out parts when needed. We have tried pumping nitrogen into these but I still run between 35 and 50 RH. Has anyone tried converting a

Plastic BGA cracking

Electronics Forum | Thu Jun 25 10:51:08 EDT 2020 | kumarb

How long have these devices been out of their sealed dry packs? Did you receive the devices factory new or from a broker of such parts? What may be happening is that moisture crept inside the device and there requires the parts to be baked before you

PCB bake-out after cleaning

Electronics Forum | Wed Dec 17 10:25:47 EST 2003 | blnorman

I may have asked this question before but couldn't find anything when I ran a search. Question, after ultrasonically cleaning our boards we bake them out to drive off residual moisture. Current requirement is 24 hours @ 105�C. I seem to remember a


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