Electronics Forum | Thu May 06 08:29:41 EDT 2004 | Christopher Lampron
10% RH) Do these stored components need baking before I use them now or not? * Depends on the MSD level (should be marked on packaging) Level 6 component need to be baked prior to asembly no matter what. Other levels should be OK if they were store
Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory
Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb
Electronics Forum | Mon Dec 16 15:10:56 EST 2002 | Randy Villeneuve
We do not bake any of our boards prior to wave solder. If we did we would have one heck of a large oven. I would assume you are concerned about moisture sensitive components. In most cases your top side parts should only get to 80 degrees centigarde
Electronics Forum | Wed Mar 05 10:59:04 EST 2003 | jfb2003
Currently, my company's applies a PCB bake (5 hours @ 125C) for all SMT PCB's prior to surface mount assembly. Many of us believe this is a non-value added activity, and have concluded it can be eliminated. With today's PCB process controls coupled
Electronics Forum | Thu Feb 05 15:38:21 EST 2004 | mrmaint
Pete C We do bake our tray parts. I am familiar with the ipc specs. The problem is for example: a level 4 component can only be out a total of 72 hrs before rebake is required. If this is a tube or reel part, the 125c bake temp that is recommended wi
Electronics Forum | Mon Jul 21 10:33:51 EDT 2008 | maxpower097
Hey guys. I'm a newb and was thrown in to this project. The company I work for opened some spools of chip they have and it says on a sticker, "BAKE if PINK" and it is pink. Is this something we can do onsite? I have researched it and it says bake a
Electronics Forum | Tue May 14 14:59:47 EDT 2002 | fmonette
Greg, As Dave pointed out, the main reason to bake components is to remove absorbed moisture from moisture-sensitive components. All you need to know on this subject, including the specific bake conditions (temperature and duration) are clearly s
Electronics Forum | Wed Apr 06 04:18:03 EDT 2011 | emmanueldavid
TK, Hope you got it right only for this round of assemblies. Well, passing through a Reflow belt is not an ultimate process to dry circuit cards & take out moisture from Solder finished layers. First of all, if the packs were not unsealed (even s
Electronics Forum | Wed Dec 17 14:38:25 EST 2003 | davef
Francois Monette [Cogiscan Inc. 450-534-2644 fmonette@cogiscan.com ] is the resident genius on component and board baking. If he doesn't chime-in a in a day or so, give him a shout. He seems to nap quite a bit. Alternately, if you search on his na
Electronics Forum | Mon May 17 13:21:45 EDT 2021 | SMTA-64387881
PWB Bake out or other elevated temperture processes can cause issues with oxidation of that Nickel layer. The gold porosity can vary from batch to batch, but also process changes can contribute. Are you baking the boards or have previous reflow pro
