Electronics Forum | Mon Apr 30 09:20:50 EDT 2001 | Steve Zanola
We have seen the same thing. Our vendor recently change the way the BGA is fabricated and the new package warps. We are currently trying to adjust our process paramentes to fix this problem. I will try the "bake out" suggestion and see if it cor
Electronics Forum | Wed Jun 20 21:58:37 EDT 2001 | fmonette
Dave, if you have a level 6 then you have no other option then to bake it and reflow before it exceeds the specified floor life. For more details check out the joint IPC/JEDEC standard J-STD-033. It can be downloaded for free at http://www.jedec.org.
Electronics Forum | Fri Jan 22 11:46:08 EST 1999 | Michael Larsen
I was just wondering what solutions are out there for dry storage. Our basic need is to be able to store boards that have been baked and need to remain moisture free for up to a week.
Electronics Forum | Wed May 13 07:24:12 EDT 1998 | Sherry
Does the temp. profiles used to reflow double sided pcb's through a IR oven on FR4 board material have to be re-established if it is changed to polyimide? Boards will be baked out prior to assembly. any response would be most appreciated.
Electronics Forum | Thu May 14 04:11:33 EDT 1998 | JACK CHEN
| Does the temp. profiles used to reflow double sided pcb's through a IR oven | on FR4 board material have to be re-established if it is changed to | polyimide? Boards will be baked out prior to assembly. | any response would be most appreciated.
Electronics Forum | Mon Feb 03 10:03:30 EST 2003 | ksfacinelli
What are people using for re-vacuum sealing of opened parts. The parts of coarse would be baked out prior to sealing. The system should be ESD compliant. Need some help, Kevin
Electronics Forum | Tue Apr 22 13:32:23 EDT 2003 | swagner
Does anyone have any data pertaining to contaminates baking out of a fiberglass resin pallets used for processing flex circuits? If so does this phenomena increase over time? Thanks,
Electronics Forum | Thu Jan 15 15:08:43 EST 2004 | mrmaint
Are your qfp's being stored properly. I have seen this in the past and it turned out to be a moisture issue. We saw most of the problems on the corners. The component would swell during the reflow process thus lifting the corners. After baking the re
Electronics Forum | Sat Feb 14 20:30:55 EST 2004 | Dean
What are your preheat rates? Try a slower ramp. A typical insurance policy is to kapton tape the gold card edge. If your problem persists, try baking the boards to drive the moisture out.
Electronics Forum | Thu May 06 14:22:06 EDT 2004 | Rob
Okay... to follow-up on my scenario. Would it be cheaper to get a resealer with dessicants and humidity indicators or a baking oven, or both. Is there a moisture controlled storage cabinet (ideally 3'x6'x1' or in that vicinity)? Would be interested
