Electronics Forum | Mon Jun 28 10:04:41 EDT 2004 | jdumont
Yes please send a copy of that paper as I dont have access to the 033 STD. That would be great, thanks a lot. jdumont@astromed.com JD
Electronics Forum | Mon Jun 28 14:45:50 EDT 2004 | davef
JDumont: In trying to find the paper that Francois referenced, poke around his site [ http://www.cogiscan.com ], where he's collected a bunch of papers on the control of moisture sensitivity in components.
Electronics Forum | Mon Jun 28 15:27:33 EDT 2004 | davef
Oh, you posted something about that a couple of weeks ago. Nice that you have the justification, too bad that's the way you needed to get it.
Electronics Forum | Wed Jul 14 02:54:12 EDT 2004 | kmccarten
Feel free to also take a look at http://www.drycabinet.com We provide Dry Cabinet and Dry box storage solutions to keep MSD 's below 5% RH. You can also reach us by visiting http://www.totechamerica.com
Electronics Forum | Wed Apr 20 01:08:16 EDT 2005 | charly
actually, i received a shipment from supplier where the vacuum seal was puntual and the HIC is out of order, the supplier ask me to bake and keep back into the store, but i worry is there any quality impact if i do so?
Electronics Forum | Fri Feb 01 05:40:17 EST 2008 | aj
we have also seen this issue but seems to be on boards whee there is a open space and no copper hatching. We bake these boards out for 4-6 hrs @ 125oC. aj...
Electronics Forum | Fri Jul 25 07:26:45 EDT 2008 | realchunks
From what I can understand, you say this only happens on one type of BGA (?). Try baking this BGA. You may have out gassing during rework. Do you use tacky flux during rework? If so, try a different flux. And last, check your rework profile.
Electronics Forum | Tue Jan 06 14:37:27 EST 2009 | stevek
The easiest way to prove out the absorbtion theory is to weigh the parts before wash, after wash, and after baking. You probably want to do this with the bare parts in isolation as the fab will pick up considerable moisture. Differences in weight s
Electronics Forum | Tue Feb 03 11:33:08 EST 2009 | nath
Hello, Can anyone list out issues or concerns with assembly with PTFE based laminates. I am looking for any concerns related to handling, SMT reflow, Wave, Baking, rework, BGAs? ANy feedback is much appreciated. Thanks!
Electronics Forum | Tue Feb 03 16:23:40 EST 2009 | gnath
Hello, Can anyone list out issues or concerns with assembly with PTFE based laminates. I am looking for any concerns related to handling, SMT reflow, Wave, Baking, rework, BGAs? ANy feedback is much appreciated. Thanks!
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