Electronics Forum | Mon Jan 10 16:14:17 EST 2005 | fmonette
Hi Gary, With plastic BGAs it is more difficult to remove the trapped moisture because of ground planes in the substrate. If your parts have been sitting around for a long time they may be soaked with moisture and in some cases the 48 hours bake cy
Electronics Forum | Thu Aug 16 13:00:32 EDT 2007 | russ
Here is what you need to do if you can, Since you want to shporten the bake time you need to increase temp. weigh a board prior to your current bake process (you need very hi resolution scale for this) weigh the same board after current process a
Electronics Forum | Tue Aug 14 20:28:38 EDT 2007 | davef
Just talking off the top of my head, I'd guess that greater weights can be tolerated on the bottom side of two sided reflow when using lead free solder than leaded solder.
Electronics Forum | Mon Jan 10 11:08:39 EST 2005 | mrgman9999
We are having a problem with popcorning of a plastic BGA that has been under careful humidity control. We have had problems in the past and some have been related to too much trapped internal solvents from the die attach epoxy. We did a life time b
Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef
Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to
Electronics Forum | Tue Aug 14 19:49:21 EDT 2007 | htran
My apology for not mentioned the J-STD-001DS. I didn't mean to trick you. Anyway thanks for your inputs. You are the man with the smt knowledge, I am sure that I will be asking you for some more answers again. Thank you for the link. I will loo
Electronics Forum | Fri Aug 17 17:55:42 EDT 2007 | htran
My small reflow oven doesn't have the rails (only metal mesh). I personally don't think it was built for double side reflow assembly and there is vibration as well. We are a small low volume mfg house and our reflow oven doesn't have the capability t
Electronics Forum | Sat Aug 18 08:40:34 EDT 2007 | davef
Here's how to double reflow your QFP: * Reflow the first side with the QFP according to plan. * Paste second side and place components according to plan. * Lightly crinkle a small, QFP-size piece of aluminum foil. [Note: the degree of crinklization
Electronics Forum | Fri Nov 05 21:22:34 EST 1999 | chartrain
Amazing in today's technology that people still bake because "that's the way we've alawys done it". Baking is a band aid for poor manufacturing of the PCB. Moisture can become trapped between the layers during buildup. This moisture when it contacts
Electronics Forum | Fri Apr 23 14:27:22 EDT 2010 | hegemon
I am concerned about a 'tarnishing' effect after moisture bake out that affects solderability on a batch of PCBs. This finish is new to us,and I am wondering if anyone has ideas about how to drive the moisture out of the boards without compromising
.gif)
winsouce.jpg)