Full Site - : baking out mositure (Page 8 of 45)

Silver Immersion Finish - Moisture bake out guideline?

Electronics Forum | Mon Apr 26 18:09:07 EDT 2010 | hegemon

Obviously knowledge in this area is still in a bit of a 'flux'. Dave, you had the right idea, the "putz"s signed off on the responsibility, and sent a new batch o'boards. FAST. This new batch were at least date code in 2010, and we had no issues so

Silver Immersion Finish - Moisture bake out guideline?

Electronics Forum | Fri Apr 23 17:59:54 EDT 2010 | hegemon

Therein lies the issue. Unknown storage conditions before we received the PCBs, date codes just expired (2 weeks), first article is de-lam city! Had a bad feeling about it. Have read some studies showing that there is no linear tie in of visual cha

Silver Immersion Finish - Moisture bake out guideline?

Electronics Forum | Sat Apr 24 10:43:31 EDT 2010 | davef

Hege: Sounds like this customer is a putz. Ask the putz to sign a release, acknowledging responsibility. Here's a couple more links on imm silver: * http://www.pcbdesignschool.com/wp-content/uploads/2009/08/the-study-measurement-and-prevention-of-t

Silver Immersion Finish - Moisture bake out guideline?

Electronics Forum | Mon Apr 26 14:40:07 EDT 2010 | blnorman

We had one product that used immersion silver plating. There were a couple of instances where we saw tarnishing, and elemental analysis confirmed the presence of sulfur. These boards did have the anti-tarnish sheets between boards, but somehow they

solder pop out from via hole at secondary reflow

Electronics Forum | Mon Jul 08 11:53:40 EDT 2002 | yngwie

Hi Guys, We prints solder paste on via hole as the holes are used as the test points. This is a clean process. In normal production, upon completion of a primary side, board will proceed to secondary process immediately. The problem happened when

Solder paste transfer from jar to cartridge

Electronics Forum | Tue May 11 09:44:48 EDT 2010 | dyoungquist

Lower humidity: Pros: Helps with mositure sentative devices. Cons: 1)Paste exposed to the dry air during your porcess will dry out quicker. 2) Drier air promotes more ESD issues, i.e. more electrostatic generation.

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 12:25:34 EDT 1998 | Wayne

Vacuum Bakeout Ovens For many years vacuum bakeout ovens have been used in the hybrid industry for removal of moisture from ceramic cercuits prior to hermetically sealing packages. In this process the vacuum oven certainly reduces the bakeout cycle

Re: Component Baking

Electronics Forum | Fri May 22 11:12:25 EDT 1998 | Mike Glenn

| | Does anyone know about low pressure/low temperature | | ovens used for baking of moisture senstive | | components? | | Thanks | I need to know from where your need came. I usually just bake in conventional ovens with specified times and tempera

Voids in every Lead-free BGA solder Joint

Electronics Forum | Fri Nov 22 15:59:43 EST 2002 | GSW

What type of reflow profile are you using ? There is a void reduction profile recommeded by some paste manufacturers, Try that it might help. Did you check the components or the board and see if they have absorbed mositure ? try baking the boards and

Re: Component Baking

Electronics Forum | Fri May 22 13:20:33 EDT 1998 | Earl Moon

| | | Does anyone know about low pressure/low temperature | | | ovens used for baking of moisture senstive | | | components? | | | Thanks | | I need to know from where your need came. I usually just bake in conventional ovens with specified times a


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