Electronics Forum | Mon Apr 26 14:40:07 EDT 2010 | blnorman
We had one product that used immersion silver plating. There were a couple of instances where we saw tarnishing, and elemental analysis confirmed the presence of sulfur. These boards did have the anti-tarnish sheets between boards, but somehow they
Electronics Forum | Mon Jul 08 11:53:40 EDT 2002 | yngwie
Hi Guys, We prints solder paste on via hole as the holes are used as the test points. This is a clean process. In normal production, upon completion of a primary side, board will proceed to secondary process immediately. The problem happened when
Electronics Forum | Tue May 11 09:44:48 EDT 2010 | dyoungquist
Lower humidity: Pros: Helps with mositure sentative devices. Cons: 1)Paste exposed to the dry air during your porcess will dry out quicker. 2) Drier air promotes more ESD issues, i.e. more electrostatic generation.
Electronics Forum | Tue May 26 12:25:34 EDT 1998 | Wayne
Vacuum Bakeout Ovens For many years vacuum bakeout ovens have been used in the hybrid industry for removal of moisture from ceramic cercuits prior to hermetically sealing packages. In this process the vacuum oven certainly reduces the bakeout cycle
Electronics Forum | Fri May 22 11:12:25 EDT 1998 | Mike Glenn
| | Does anyone know about low pressure/low temperature | | ovens used for baking of moisture senstive | | components? | | Thanks | I need to know from where your need came. I usually just bake in conventional ovens with specified times and tempera
Electronics Forum | Fri Nov 22 15:59:43 EST 2002 | GSW
What type of reflow profile are you using ? There is a void reduction profile recommeded by some paste manufacturers, Try that it might help. Did you check the components or the board and see if they have absorbed mositure ? try baking the boards and
Electronics Forum | Fri May 22 13:20:33 EDT 1998 | Earl Moon
| | | Does anyone know about low pressure/low temperature | | | ovens used for baking of moisture senstive | | | components? | | | Thanks | | I need to know from where your need came. I usually just bake in conventional ovens with specified times a
Electronics Forum | Sat Sep 26 22:08:07 EDT 1998 | Jeff Sanchez
I recieved a pack of sensitive IC's that said they needed to be baked befor certain processes. If I need to do rework, do I have to bake prior to single soldering of these IC's. Or can I just place one as needed by hand with out baking? Any info woul
Electronics Forum | Wed Feb 06 17:28:27 EST 2008 | blnorman
We have some components on a reel that are 2.3 mm in thickness and need to be baked out. The reel has a warning not to exceed 50�C. According to J-STD-33, the proper bake out is 67 days @ 40�C.
Electronics Forum | Fri Feb 09 09:42:33 EST 2018 | jmedernach
I completely agree. J-STD-033 spells out the "how to" of baking, quite clearly. You have to bake something for an expensively long time at 80 - 85C in order to properly desiccate your components.
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