Electronics Forum | Sat Sep 26 22:08:07 EDT 1998 | Jeff Sanchez
I recieved a pack of sensitive IC's that said they needed to be baked befor certain processes. If I need to do rework, do I have to bake prior to single soldering of these IC's. Or can I just place one as needed by hand with out baking? Any info woul
Electronics Forum | Wed Feb 06 17:28:27 EST 2008 | blnorman
We have some components on a reel that are 2.3 mm in thickness and need to be baked out. The reel has a warning not to exceed 50�C. According to J-STD-33, the proper bake out is 67 days @ 40�C.
Electronics Forum | Fri Feb 09 09:42:33 EST 2018 | jmedernach
I completely agree. J-STD-033 spells out the "how to" of baking, quite clearly. You have to bake something for an expensively long time at 80 - 85C in order to properly desiccate your components.
Electronics Forum | Mon Dec 16 15:00:56 EST 2002 | sueph
We have always baked our assembled boards prior to wave solder, but have recently learned that there are some companies out there who don't. I checked with one of my supervisors, and he said that baking is recommended but not required. I'm wonderin
Electronics Forum | Fri Jul 30 17:22:48 EDT 1999 | Dave F
| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so
Electronics Forum | Mon Dec 16 15:38:17 EST 2002 | Randy Villeneuve
No parts or boards are baked unless they are moisture sensitive and were left out too long and that is for reflow only. In your case there should be no reason to bake becouse the boards should be vacuum packed as they come in as well as any moisture
Electronics Forum | Thu Jul 17 12:52:06 EDT 2008 | djd7554
We are baking the moisture out of our ic chips. They are on tape and reel. Can we bake them on tape and reel or do we have to put them in trays?
Electronics Forum | Tue Mar 17 10:47:56 EDT 2020 | davef
IPC-1601 covers PWB bake-out, methods for determining optimum bake time and temperature, caveats for certain PWB plating finishes, etc. IPC-1601 is to bare boards as J-STD-033 is to components
Electronics Forum | Fri Feb 10 13:30:31 EST 2023 | rwyman
Yes, that point remains unchanged. Just a general comment that there have been updates. e.g. re: desiccant re-use, certain devices no longer requiring bake-out, or bake times have been adjusted, and more.
Electronics Forum | Wed Dec 13 14:37:06 EST 2000 | Chris
I should explain that this bake out was performed after population. The solder paste slumped terribly after this bake out. However, after the back out and after reflow, no bridging.
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