Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef
There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si
Electronics Forum | Thu Aug 16 13:00:32 EDT 2007 | russ
Here is what you need to do if you can, Since you want to shporten the bake time you need to increase temp. weigh a board prior to your current bake process (you need very hi resolution scale for this) weigh the same board after current process a
Electronics Forum | Wed Nov 10 09:42:05 EST 1999 | Boca
Generic fabs should not require baking. Some special cases like teflon and flex circuits take moisture very well, they often continue to require a trip to the oven. Best wishes, Boca
Electronics Forum | Fri Nov 05 21:22:34 EST 1999 | chartrain
Amazing in today's technology that people still bake because "that's the way we've alawys done it". Baking is a band aid for poor manufacturing of the PCB. Moisture can become trapped between the layers during buildup. This moisture when it contacts
Electronics Forum | Fri Apr 23 17:59:54 EDT 2010 | hegemon
Therein lies the issue. Unknown storage conditions before we received the PCBs, date codes just expired (2 weeks), first article is de-lam city! Had a bad feeling about it. Have read some studies showing that there is no linear tie in of visual cha
Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve
Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men
Electronics Forum | Wed Apr 06 04:18:03 EDT 2011 | emmanueldavid
TK, Hope you got it right only for this round of assemblies. Well, passing through a Reflow belt is not an ultimate process to dry circuit cards & take out moisture from Solder finished layers. First of all, if the packs were not unsealed (even s
Electronics Forum | Tue Sep 07 17:12:34 EDT 2004 | davef
No one knows what type of board you use. So, assuming you're talking a fairly standard FR4. Q1a. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? A1a. We'd guess your board could take 250*C for may
Electronics Forum | Tue Jul 06 05:33:46 EDT 2004 | ANDREW
1)What is the MSD level for PCB? 2)I have some PCB's with HIC (humidity indicator card ) has turn to pink at 50%. Should I bake the PCB prior to assembly process.This fab is a complex board with various kind advance package assembled on the board.
Electronics Forum | Fri May 31 10:35:46 EDT 2002 | dason_c
I think that the IPC spec only apply to the MSD. I had a paper from Lucent and forwarded by Francois Monette, please aware that the first 2 hours, the moisture doesn't bake out from the assembly/component and result show that it is increase the weigh
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