Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.
| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard
Electronics Forum | Fri Jan 07 01:05:40 EST 2000 | Dennis O'Donnell
I suggest you check out as many vendor at first as possible. Price varies greatly depending on your requirements. Once you find a company that has a price range that you are comfortable with, most can provide you with their formula so that you can
Electronics Forum | Fri Dec 17 02:43:24 EST 2010 | grahamcooper22
Ideal storage conditions to stop pcbs absorbing moisture is at less then 5% RH, for example in sealed moisture barrier bags. You mention that storage was at 40~70%...at these levels the pcb will absorb quite a bit of moisture. Your baking time was no
Electronics Forum | Fri Jul 30 19:58:28 EDT 1999 | ScottM
| | | Hello Netters, | | | | | | I have a customer who wants us to aquaeos wash a PCB after all operations have been performed. The PWB is two layer FR4 with a Transformer, a Multichip Module with Conformal Coating, (6) 11" insulated wires that are
Electronics Forum | Thu Jul 01 15:12:16 EDT 2010 | siddharth
Thanks to all for their inputs. @Hexielectronics, I am now trying to assemble the board by attaching it to a frame and removing the frame while waving it. I plan to put the boards back on the frame after the board cools down. Could you explain more
Electronics Forum | Wed May 13 07:24:12 EDT 1998 | Sherry
Does the temp. profiles used to reflow double sided pcb's through a IR oven on FR4 board material have to be re-established if it is changed to polyimide? Boards will be baked out prior to assembly. any response would be most appreciated.
Electronics Forum | Thu May 14 04:11:33 EDT 1998 | JACK CHEN
| Does the temp. profiles used to reflow double sided pcb's through a IR oven | on FR4 board material have to be re-established if it is changed to | polyimide? Boards will be baked out prior to assembly. | any response would be most appreciated.
Electronics Forum | Fri Feb 01 05:40:17 EST 2008 | aj
we have also seen this issue but seems to be on boards whee there is a open space and no copper hatching. We bake these boards out for 4-6 hrs @ 125oC. aj...
Electronics Forum | Thu Nov 28 20:37:40 EST 2002 | Dreamsniper
I'm in the process of generating work instructions for our stores and production process with regards to moisture sensitive devices.And I'm a bit confused. I found out that we have many TSOP's, QFP's and BGA parts in sealed bags that have not been op
Electronics Forum | Fri Sep 06 11:16:08 EDT 2002 | dason_c
To check any solder crack, open under the BGA/CCGA. I am using a destruction test to find out is it related to the reflow profile or the Fab issue. 1. Depense the Dye (I use Dykem Steel Red) under the device. 2. Cure the dye 3. Remove the device 4.
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