Electronics Forum | Fri Jan 18 04:45:32 EST 2002 | wbu
Ianchan, baking as being part of pre-heating is obviously sensless cause the PCB will not maintain any of that heat till soldering. Common reason for prebaking PCB�s is getting the moisture out to prevent outgassing, warpage and maybe other defects.
Electronics Forum | Wed Aug 17 13:57:27 EDT 2005 | ppwlee
We have encountered what appears to be mask discoloration after wave soldering. The areas of concern coincide with the areas that were exposed selectively by fixtures during wave soldering, dominated by one date code of PCB with a slightly different
Electronics Forum | Wed Nov 28 16:08:38 EST 2007 | jmelson
I've been using Xilinx TQFP's in the 44 and 144 lead sizes with no trouble. I don't even bake them before reflow and have never had any problem. The Xilinx parts are certainly NOT sensitive, I could not break one with my bare hands if I tried (I ha
Electronics Forum | Sat Mar 06 06:15:14 EST 2004 | Bryan
Thanks Tommy. In fact I've tried many types of profile,but it didn't work.I'll try to make the peak temp. as low as 205C and dwell long as in some threads Dave said.I've tried baking the BGA and PCB before mounting also dindn't work.yes,I've heard th
Electronics Forum | Mon Aug 01 18:50:46 EDT 2005 | crishan
Hi Cecil, We using conformal coating in our manufacturing area, we did use to use Humiseal, others have been Bectron and Peters. We recentalt switched all lacquering to Peters, since it is lead free and it is a lot friendly than Humiseal. To answer
Electronics Forum | Thu Jan 26 17:59:07 EST 2006 | GS
How is RH% inside your Dry Cabinet ? What is the most critical MDL of your MSDs soldered on your board ? Best instructions about Handling of MSD you can get from Standard J-STD-033B/C. The defects you encountered at test it could be moisture absor
Electronics Forum | Fri May 25 08:06:19 EDT 2007 | davef
Soldering PTFE boards * Exposure to the high temperatures needed for solder reflow poses no problem of loss of peel strength since the exposure times are relatively short. * There are many different types of PTFE based products that may perform diff
Electronics Forum | Thu Mar 29 13:15:18 EDT 2007 | adrian_nishimoto
We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using liquid or tacky flux does not always ensure proper wetting of the pads. Also The BGA sits closer to the PCB making cleaning and endoscopic inspection
Electronics Forum | Fri Jun 07 10:02:01 EDT 2013 | sarason
In thirty years of Electronic service I have never had problems with moisture in boards when hand soldered. I have worked on boards in boxes for defense through industrial control, joy rides etc. Sometimes they some back buried in half an inch of dus
Electronics Forum | Mon Feb 09 09:00:17 EST 2015 | jax
Outside the MSD issues stated already (and I cannot provide a exact time not knowing multiple factors like Humidity levels, temps, exposure times, etc...) OSP might be the very worst finish to use in this scenario of side 1 / store on a shelf / side
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