Electronics Forum | Fri Jan 29 08:11:06 EST 2010 | vetteboy86
My company has an oppurtunity at an account, but it would require us to populate flexible PCB's. This is something we do not have any expereince in. Are there any good sources I can reference to learn about this process?
Electronics Forum | Thu Dec 14 11:49:37 EST 2017 | barryg
When the board is populated on the second side, and after reflow, components are shifted, skewed with solder flowed on the leads of the components and not on the PCB land.
Electronics Forum | Mon Mar 12 08:00:14 EDT 2007 | rgduval
It sounds like you may be thinking of two different test methodologies. What is required? Bare-bard testing, to verify pcb fabrication? Or populated board testing, to verify manufacturing? If it's bare board testing, the fab house should advise a
Electronics Forum | Mon Nov 27 17:39:37 EST 2000 | Dave F
Daniel: In response to your questions: * Moisture level (wt%) that may cause delamination in PCB�s. - Certainly, it depends, but 100% moisture will not cause delamination of a PCB. [Now, heating that water is another question, isn�t it? ;-)] *
Electronics Forum | Sun Jan 19 10:45:04 EST 2003 | davef
For laminated FR4 PCB, we bake between 6 and 24 hours at 100�C. [Search for other bake recipes in the fine SMTnet Archives.] Alot of the determination of baking time is a function of: * Amount of moisture absorbed. * Amount of moisture you need to r
Electronics Forum | Fri Nov 05 21:22:34 EST 1999 | chartrain
Amazing in today's technology that people still bake because "that's the way we've alawys done it". Baking is a band aid for poor manufacturing of the PCB. Moisture can become trapped between the layers during buildup. This moisture when it contacts
Electronics Forum | Mon Aug 05 03:03:50 EDT 2002 | jkhiew
Hi all, I had some old stock of CEM1 pcb: a. How long & under what temp. condition shall I bake it to eliminate the trapped moisture ? b. Is the baking time & temp. different for 3 yrs old stock, 2yrs old stock & 6 month old stock ? c. For CEM1 pcb,
Electronics Forum | Thu Feb 27 03:26:13 EST 2003 | damianlai
Hi, I would appreciate some advice / recomendations regarding conditioning of PCB's before use. Our standard PCB's are double sided and rigid multilayer FR4. We are currently baking everything over 3 months old for 2 hours at 125 degrees C. Is thi
Electronics Forum | Thu Feb 21 09:53:00 EST 2013 | Mr_Bo_Jangles
Has anyone used their AOI to try to catch components that may be inadvertently placed in a location it shouldn't be? Every once in a while our equipment may drop a part onto a PCB and that part will adhere to pad. So the question has been brought u
Electronics Forum | Thu May 15 07:37:49 EDT 2003 | pteerink
Have seen similar circumstances a couple times. Possible causes: 1) PCB defect - remove the BGA and inspect/test the PCB for shorts. ( trace short, layer short etc ) 2) PCB defect that only shows up when the BGA is populated - a short somewhere o
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