Electronics Forum | Wed Jul 03 11:37:36 EDT 2002 | fmonette
Dason, I apologize if some of the information sounds redundant but I don't think I explained my point very well (and the standard can get really confusing at times). I definitely agree with using C-SAM to look for internal defects. My only advise i
Electronics Forum | Sun Mar 07 19:53:38 EST 2004 | praveen
Hello, Voids in BGA can not be eliminated. You can only minimize them by reducing the solder paste volume. Try to bake the plastic BGA's and PCB both as per the standard. Check the PCB at the BGA locations if the via's are masked.Masked via's result
Electronics Forum | Mon Mar 29 13:59:27 EST 2004 | jdumont
Well how can I correct this? Would baking the board prior to any operations help? Is this an issue I should get the PCB manufacturer involved with, or something that is common and just live with it?
Electronics Forum | Fri Apr 15 05:52:20 EDT 2005 | charly
hi Jon, does it mean the protective layer is coated after the immersion silver process? if we need to bake the PCb due to moisture issue, then we can not hold the pCB long due to the missing protective layer even with vacuum seal environment
Electronics Forum | Mon Sep 26 08:39:39 EDT 2005 | avalancher
Not that this actually happens anymore, but could it possibly be moisture in the PCB? Have you tried baking one or two for a couple of hours then run to see if it repeats?
Electronics Forum | Wed Nov 14 01:18:20 EST 2007 | reypal
How about your bare pcb handling? do you stuff smd component prior hand soldering? you can try to bake the pcb and then see if this problem still exist.
Electronics Forum | Wed Jul 28 08:41:47 EDT 2010 | vetteboy86
I believe we are seeing some wetting issues as we have tried to bake these assemblies ourselves. Our PCB supplier is coming in next week to address the issue. Is there a rule of thumb or formula for determining correct parameters. Thanks
Electronics Forum | Fri Jul 23 02:17:26 EDT 2010 | joseph_smile
by viewing your posting i came to know this is solder ability issue which is because of marginable solder ability of PCB / components, just ensure that issue due to PCB or component . check the msl of of substrate / component. verify the baking r
Electronics Forum | Thu Oct 17 05:16:44 EDT 2013 | vincentdesilva2003
Anyone can help me how many percentage of blowholes and pinholes if i do the followings: 1. Increase copper plating thickness more than 25 microns. 2. Pre Baking of PCB to remove gassing by drying out the PCB's
Electronics Forum | Wed May 03 16:37:10 EDT 2017 | charliedci
I don't believe there should be any issues with the HASL finish. The issue is how long on the shelf and is a bake out required to remove moisture from PCB, as in any FR4 PCB's that may have had time to absorb moisture.
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