Electronics Forum | Fri Jun 01 23:57:21 EDT 2012 | bwjm
HI Guys, i am facing similar issues with this BT resin material too. PCB specs are 4 layers, Nelco400013, same Tg and Td. My PCB delam after reflow. The PCB has both side mounted with SMDs. Initial mounting on the btm side after reflow, no delam. B
Electronics Forum | Fri Dec 17 00:55:22 EST 2010 | kemasta
Hi Kim Dun take any risk in delamination bcoz u > will be the person to answer for being it. So, > we do bake all Pcbs, which have 3months of shelf > life, b4 startin any process although they are > still inside the factory packs. We keep it in
Electronics Forum | Fri Oct 19 00:37:43 EDT 2001 | ianchan
Hi, my guys did such solder paste deposits on PCB bareboards before, (before my physical join with my current company), approximately 2-3 years ago, for a small Lot run. What the PCB supplier did was to apply "block" shaped Sn/Pb paste alloy onto t
Electronics Forum | Mon Dec 20 19:09:54 EST 1999 | Chris
If your flex circuit is only populated on one side, you can have the PCB vendor palletize the flex for you. What you do is have the flex circuit laminated to 062" FR4 using a thermoset adhesive like Dupont WA. Standard flex circuit adhesive. Howev
Electronics Forum | Fri Jul 30 19:58:28 EDT 1999 | ScottM
| | | Hello Netters, | | | | | | I have a customer who wants us to aquaeos wash a PCB after all operations have been performed. The PWB is two layer FR4 with a Transformer, a Multichip Module with Conformal Coating, (6) 11" insulated wires that are
Electronics Forum | Wed May 13 07:24:12 EDT 1998 | Sherry
Does the temp. profiles used to reflow double sided pcb's through a IR oven on FR4 board material have to be re-established if it is changed to polyimide? Boards will be baked out prior to assembly. any response would be most appreciated.
Electronics Forum | Thu May 14 04:11:33 EDT 1998 | JACK CHEN
| Does the temp. profiles used to reflow double sided pcb's through a IR oven | on FR4 board material have to be re-established if it is changed to | polyimide? Boards will be baked out prior to assembly. | any response would be most appreciated.
Electronics Forum | Mon May 20 16:56:24 EDT 2002 | Gary
Excess slump of paste and mis-registration can cause solder balls along with moisture. Use same date code of pcb and run with no components, paste only. Also pre-bake boards with humidity sensor in oven. If high humidity, moisture and solvent residue
Electronics Forum | Tue Apr 01 19:36:02 EST 2003 | iman
from my humble experience : 1) check if there is nickle contaminate in the gold bath? shd have report data from the PCB fab house. 2) check if your production did 48hr bake at 125degC, IF the BGA did not come in its "original" MSD cozy packaging.
Electronics Forum | Thu Jul 31 21:21:54 EDT 2003 | praveen
Yes we are baking the boards and the BGA. Using a CDM material pallet to hold the PCB as clamping is a problem without that.
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