Electronics Forum | Mon Dec 25 08:43:35 EST 2017 | arjunkolavara
Hi , We are having Pin hole issues on the passive locations in the board after the SMT reflow process. Details: PCB surface Finish : ENIG . Solder paste : Alpha OM338 – M13 / Indium SMQ92J Location : Its Random and more on passive components. {
Electronics Forum | Wed Oct 20 14:34:29 EDT 2021 | korb23
1 1 I work for a small company as an apprentice. We build mostly mass produce double sided PCBs. We are having trouble keeping the pin headers flat to the PCB through the reflow oven process. The first side is pasted through a printer and populate
Electronics Forum | Mon Aug 11 05:26:55 EDT 2008 | gersla
Hi All We are looking for not expensive solution for misprint PCB cleaning for both one and double side assemblies. We have tried different ways and cleaning solutions like: IPA, Vigon Zestron SD300, Vigon SC200 by deep the boards in to stainless ste
Electronics Forum | Tue Jul 20 15:02:49 EDT 2010 | vetteboy86
I've seen this warp issue across several different PCB's we assemble. One of the biggest head ache's is getting the boards to transfer between machines, converyors, and inside our pick and place. Due to the warpage, transport between conveyors is dif
Electronics Forum | Fri Jul 23 02:54:47 EDT 2010 | wizzkid
I think that it can be solved by placing ths into a baking oven with the set point above the PCB Tg. For this process to be succesful, weights need to loaded onto the PCB stack during the heating cycles. Once the cycle is complete, the PCB stack will
Electronics Forum | Fri Aug 12 22:10:24 EDT 2005 | Mika
I agree with all the prior postings! But I have some additional thoughts about this. If there is a build up of moistures (% humidity) inside the pcb; before you reflow the pcba; then you will have the result out of the oven, just as you described. My
Electronics Forum | Thu Dec 20 19:41:27 EST 2001 | ianchan
I called a cuppa of indutrial friends, and they concluded that the flex-PCB in question, was being subject too high a oven-baking temperature of 100deg-C...50~60deg-C oven-baking temperature would be more appropriate for flex-PCB, due to its very pad
Electronics Forum | Sun Apr 15 20:58:17 EDT 2007 | darby
PCB > Origin > O* > Skip = No Data In > PCB > Mount > M* > Skip = No Data In > System > Parameter > Position > Waiting Pnt Check that the waiting point is not set at such a co-ordinate that the PCB sensor is seeing the gantry. The pcb sensor also h
Electronics Forum | Fri May 28 12:51:05 EDT 2021 | cbart
1. If a populated PCB is put on a ESD safe Rack, is it able to be placed on a Plastic Shelf? = I would say no, here is why: if there is an esd event on the rack/tray where will it go with no path to ground? being the rack is a generator you are going
Electronics Forum | Fri Mar 26 09:00:19 EDT 2010 | krish_bala
Thank you Graham for the response. The particular BGA that we currently Bake is a Level 3 BGA, which means the BGA will expire in 7 days after removal. We are currently baking the BGAs once a week for the problem described above. These devices are u
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