Electronics Forum | Mon May 31 15:09:56 EDT 1999 | JohnW
| | | | | | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processi
Electronics Forum | Mon May 31 15:10:14 EDT 1999 | JohnW
| | | | | | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processi
Electronics Forum | Tue Aug 12 19:18:34 EDT 2008 | arminski
Hi davef, couple of questions: clarifying costing of direct labor against overhead cost: an operator loading PCB onto the reflow oven is a direct cost, how about the reflow process time of the PCB while travelling inside the reflow, is that an ove
Electronics Forum | Mon Nov 20 15:10:56 EST 2017 | bstogsdill
Aerospace/military application- we have recently installed an SMT line. Our prior cleaning of RMA flux was Isopropyl Alcohol only, but with the reflow oven on line, the flux is now baked on. I am looking into FLUX OFF cleaner for removal of t
Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
Electronics Forum | Wed Jul 04 12:35:19 EDT 2001 | davef
I thought I responded this this a while ago, guess NOT!!! Wow, Dano yagot Entek boards that are that old!!!! Coo. Sounds kwazy that you�d end-up with that volume of old boards, but it�s probably one of those deals where correcting the problem keep
Electronics Forum | Mon Feb 04 12:30:25 EST 2002 | fmonette
Dave highlighted all the elements that must be considered to determine the optimal temperature and duration for a pre-rework PCBA bake process. As far as the component is concerned, it really depends if you care about not damaging the package for r
Electronics Forum | Mon Aug 13 18:16:31 EDT 2001 | fmonette
Be very careful how you perform the removal process if you want to re-use BGA/CSP devices. As you are aware, the majority of these components are classified as moisture-sensitive by the manufacturer. This means that if they absorb too much moisture
Electronics Forum | Wed Jul 03 11:37:36 EDT 2002 | fmonette
Dason, I apologize if some of the information sounds redundant but I don't think I explained my point very well (and the standard can get really confusing at times). I definitely agree with using C-SAM to look for internal defects. My only advise i
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
