Full Site - : baking temperature (Page 2 of 35)

Dr. Storage Dry Cabinets

Dr. Storage Dry Cabinets

New Equipment | Board Handling - Storage

Dr. Storage offers the most diverse selection of Dry Cabinets in the industry. The latest Dr. Storage cabinets include cabinets drying at 1% RH, drying at less than 1% RH and baking at 60°C. Cabinets are plug and play so they are up and running easil

Accu-Assembly Inc.

Despatch TDF2-52-1E Bake Oven

Despatch TDF2-52-1E Bake Oven

Used SMT Equipment | Soldering - Reflow

Despatch TDF2-52-1E Bake Oven Brand: DespatchModel: TFD2-52-1ESerial number: 194309Max Operating Temperature: 343C (650F)F.A. DUCT 7.00" DIAEXH. DUCT: 2.50" x 13.5"F.A. Damper Blade Cut to: 1.38" DIA Holes 2XEXH. Damper Blade Cut to: 11.25LGMinimum p

Tekmart International Inc.

Meet Seika Machinery, Inc. in Germany to See Its New McDry Products and Features at Productronica 2011

Industry News | 2011-11-08 14:14:14.0

Michelle Ogihara, Senior Sales Manager with Seika Machinery, Inc. will attend the Seika Sangyo GmbH Booth 317 in Hall A2 at the upcoming Productronica International Trade Fair

Seika Machinery, Inc.

X-Treme Series Automatic Drying Cabinets

X-Treme Series Automatic Drying Cabinets

New Equipment | Board Handling - Storage

Ideal solution to dry, bake, store & test Moisture Sensitive Devices Drying & Storage of Moisture Sensitive Devices is getting more and more important. With reliable design and leading specifications, X-Treme Series Auto Dry Cabinets are suitable f

EMT ELECTRONICS

Seika Machinery, Inc. to Debut New McDry Products and Features at IPC APEX EXPO

Industry News | 2011-02-14 14:41:46.0

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will debut new products and features from McDry in Booth #459 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Seika Machinery, Inc.

KYZEN® E5321 - Pallet and Maintenance Cleaning Agent

KYZEN® E5321 - Pallet and Maintenance Cleaning Agent

New Equipment | Cleaning Agents

KYZEN® E5321 is a room temperature pallet and maintenance cleaning agent. This cost effective chemistry removes all types of solder paste and flux residues, including baked on and hardened lead free high temperature flux residues from wave pallets an

KYZEN Corporation

Defluxing

New Equipment |  

Petroferm has the solution for removal of post reflow residues from every available solder paste and flux. Petroferm offers a complete line of aqueous, semi-aqueous, and solvent defluxing chemistries for use in every brand and style of cleaning equip

Petroferm Inc

SMT Dry Cabinets by Eureka Dry Tech

Industry Directory | Consultant / Service Provider / Manufacturer

Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD,PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.

Taiwan Dry Tech Corp.

Industry Directory | Consultant / Service Provider / Manufacturer / Other

Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.

Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour

Technical Library | 2018-09-21 10:12:53.0

Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.

National Physical Laboratory


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