Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Sat Aug 25 08:24:15 EDT 2007 | davef
We're unfamiliar with such component dryout requirements. Commonly, tape & reel cover tape will seperate at 60*C. So, even if your baking on a metal reel, your should keep the bake temperature ~40*C. Sure makes you want to use these parts during th
Electronics Forum | Thu Aug 30 09:56:16 EDT 2007 | blnorman
According to J-STD-033 Table 4-1, the bake out time to restore the clock to zero is not only determined by the MSL level, but the package thickness as well. Section 4.2.2 states "SMD packages shipped in low temperature carriers may not be baked in t
Electronics Forum | Fri Aug 24 12:20:41 EDT 2007 | petep
I have an MSL3 part (a relay) supplied in tape and reel. From what I am able to determine, these parts require baking at 257 degrees F for a minimum of 8 hours once the integrity of the seal is broken for over 168 hours. How are parts baked at th
Electronics Forum | Thu Nov 01 00:32:14 EST 2001 | ianchan
we bake boards 80~120 deg-C @1hr, after in-line DI wash. oven setting to 90 deg-C, as +/-5 deg-C, tolerance against door open/shut fluctuations = "temperature loss". If anyone has evidenced procedure, that shows no need for baking, pray do share wi
Electronics Forum | Fri Aug 24 17:30:40 EDT 2007 | jmelson
Oh, for a second there I thought it was 257 C, not F. Solder temperature! Still, one WEEK at 257 F seems way extreme. Maybe this is to bake out a part that has been underwater for a week. Is this a military part? I can't imagine any commercial-g
Electronics Forum | Sat Aug 25 08:39:15 EDT 2007 | gsala
If plastic Carrier Tape (CT)/ emboss tape, is made by: a)Polycarbonate material, it can withstand temperature around 120C� or may be more mantaining original dimension. b)Polystirene material, at max 45�C-50C� the CT starts to change dimensions and
Electronics Forum | Wed Jul 11 22:48:54 EDT 2012 | joeion
It is correct to remove moisture in PCB by baking. But I think the time and temperature is too little. According to our experience, it should be more than 60min at 120 centigrade degrees.
Electronics Forum | Tue Nov 30 02:46:21 EST 2010 | libandara
We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature – we have to maintain up to 200’C & humidity – below 5%)the control environment & ma
Electronics Forum | Tue Dec 07 07:26:50 EST 2010 | grahamcooper22
In an oven over 100 C any moisture will escape through vents. There will not be huge volumes of moisture in the oven when you are baking components so it should easily escape through vents / holes in the system leaving you with a humidity of near zer
