Full Site - : baking temperature for 196 pin bga (Page 1 of 3)

Elastomer Socket for Infineon's BGA221

Industry News | 2011-03-11 14:47:03.0

Ironwood Electronics has recently introduced a new high performance BGA socket for 0.4mm pitch 221 ball BGA - SG-BGA7162. The socket operates at bandwidths up to 10 GHz with less than 1dB of insertion loss.

Ironwood Electronics

GHz Bandwidth Socket for Dual WLCSP

Industry News | 2011-02-26 14:35:16.0

Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.

Ironwood Electronics

Stamped Spring Pin BGA Socket for Burn-in Characterization

Industry News | 2011-02-03 14:21:01.0

Ironwood Electronics recently introduced a new BGA socket addressing burn-in characterization requirements for BGA devices - CBT-BGA-6011.

Ironwood Electronics

Stamped Spring Pin BGA Socket for IDT's FCBGA144

Industry News | 2011-03-22 16:23:31.0

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for BGA devices - CBT-BGA-6014.

Ironwood Electronics

ATE Spring Pin BGA Socket for Digital Camera Processor

Industry News | 2011-01-12 15:27:11.0

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing digital camera processor - CBT-BGA-7005. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 500,000 insertions.

Ironwood Electronics

8 GHz Bandwidth Socket for Intel's ICH6 (I/O Controller Hub 6) BGA Package

Industry News | 2011-04-06 14:07:24.0

Ironwood Electronics has recently introduced a new high performance BGA socket for 1.118mm pitch, 729 pin BGA IC's. The SG-BGA-6345 socket is designed for 31X31 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss.

Ironwood Electronics

SHENMAO's New Room Temperature Solder Paste Offers Stability for a Range of Temperature Conditions

Industry News | 2020-05-30 12:34:54.0

SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.

Shenmao Technology Inc.

Vishay Siliconix Half-Bridge N-Channel MOSFET Drivers Feature 1-A Drive Capability for up to 50-V Systems and Impedance Under 1 Ohm

Industry News | 2005-01-31 15:06:35.0

The new SiP41103, SiP41104, and SiP41105 dual MOSFET drivers, which drive both the lower and upper MOSFETs in a half-bridge configuration, work in systems with supply voltages from 4.5 V up to 50 V.

Vishay Intertechnology, Inc.

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?

Industry News | 2018-10-18 10:18:58.0

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?

Flason Electronic Co.,limited

Scotle IR360 Pro 2 in 1 Infrared BGA Rework Station

Scotle IR360 Pro 2 in 1 Infrared BGA Rework Station

New Equipment | Rework & Repair Equipment

Scotle IR360 PRO is a 2 in 1 BGA rework station which can be used as infrared BGA rework station and hot air BGA Rework station with three independently temperature zones. Users can use total different BGA rework system only in one BGA rework station

Scotle Technology Group Limited


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