Full Site - : ball bonding (Page 15 of 27)

Selective Soldering and Vacuum Reflow from the Technology Leader at NEPCON South China

Industry News | 2021-07-27 15:48:50.0

BTU International, Inc. today announced plans to exhibit at NEPCON South China, scheduled to take place Aug. 25-27, 2021 at the Shenzhen International Convention & Exhibition Center, booth number 1P45. BTU will showcase the new Valence 3508 selective soldering system and PYRAMAX™ Vacuum Reflow Oven.

BTU International

BTU International and Hentec/RPS Win Best Emerging Exhibit at NEPCON South China

Industry News | 2021-11-01 18:00:38.0

Valence 3508 features an electromagnetic solder pump, unmatched thermal capability, rapid programming, and simplistic elegance in operation.

Hentec Industries, Inc. (RPS Automation)

BTU Surpasses 50 Industry Awards

Industry News | 2022-07-25 08:28:19.0

BTU International, Inc. today announced that it was awarded two 2022 EM Innovation Awards. The company was awarded in the categories of Soldering – Auxiliary Systems for its Trueflat Technology and Selective Soldering for its Valence 3508 selective soldering system. With these two awards, the company marks 51 industry awards for its thermal processing equipment.

BTU International

Professional Solutions for Hot Air SMD Rework

Industry News | 2011-08-24 21:38:06.0

From November 15-18, Finetech will exhibit professional system solutions for hot air SMD rework at the Productronica 2011 show in Munich.

Finetech

Submicron semi-automatic flip eutectic placement machine flip eutectic placement machine

Industry News | 2019-12-16 22:42:05.0

T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.

Beijing Technology Company

Machine Vision Products to demonstrate complete AOI solutions at APEX 2011

Industry News | 2011-04-05 21:42:34.0

Machine Vision Products (MVP) will be demonstrating its expanded range of AOI systems at APEX 2011 in Las Vegas. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Booth 1647.

Machine Vision Products, Inc

Machine Vision Products to Demonstrate Diverse Microelectronics and Packaging Inspection Toolbox of its Microelectronics AOI Platforms at Semicon West 2016

Industry News | 2016-07-08 19:09:41.0

Carlsbad, CA – July 8: Machine Vision Products (MVP) today announced it would be demonstrating their diverse inspection toolbox on the MVP 850 Platform for Microelectronics and Packaging at the Semicon West 2016 exhibition. Applications will include Lead Frame inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 12-14 2016. Machine Vision Products are exhibiting at booth #6471 in the North Hall.

Machine Vision Products, Inc

Kester to Feature Lead-Free Information Center at APEX 2008

Industry News | 2008-02-29 16:42:42.0

ITASCA, IL � January 7, 2008 � Kester will provide lead-free resources, technologies and products in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Los Vegas.

Kester

Machine Vision Products Demonstrates MicroElectronics and Packaging Capabilities of the Ultra 850G at Semicon West 2010

Industry News | 2010-07-02 14:58:37.0

Carlsbad, CA, July 2, 2010: Machine Vision Products today announced it would be demonstrating the Ultra 850G Semiconductor, Packaging and MicroElectronics AOI solution at the Semicon West 2010 exhibition. The exhibition is at the Moscone Center in San Francisco from July 13-15 2010. Machine Vision Products are exhibiting at booth #6362.

Machine Vision Products, Inc

Machine Vision Products Demonstrates Microelectronics and Packaging Inspection Capabilities of the Ultra 850G AOI at Semicon West 2011

Industry News | 2011-07-08 20:28:14.0

Carlsbad, CA: Machine Vision Products today announced it would be demonstrating the Ultra 850G Packaging and MicroElectronics AOI solution at the Semicon West 2011 exhibition. The exhibition is at the Moscone Center in San Francisco from July 12-14 2011. Machine Vision Products are exhibiting at booth #5368 in the North Hall.

Machine Vision Products, Inc


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