Electronics Forum | Wed Apr 04 18:27:53 EDT 2007 | Guest
Most CSPs are BGAs. Some are sent without bumps or balls. Thjos eneed to be bumped prior to processing for best results
Electronics Forum | Tue Jan 31 13:55:56 EST 2006 | samir
Anyone know what the general rules / requirements are for micro-BGA's and CSP's as to when capillary underfill is required? (ie size of bump/ball, package thickness, PCB/CSP thickness ratios, etc).
Electronics Forum | Wed Nov 08 10:48:34 EST 2023 | processman
Hi Was wondering what the general take is with reflow profiles to take into account differing solder paste alloy compared to the solder alloy used for the bumps of a bga device. For instance, SAC305 solder paste and BGA device with SAC105 (higher m
Electronics Forum | Wed Nov 04 17:18:30 EST 2009 | davef
It will be very difficult to apply the proper amount of solder with a stencil to bump a ball that is the proper size. A low volume ball is less reliable than a customary sized ball. There are: * Reballing service providers * Reballing preforms * For
Electronics Forum | Tue Nov 05 09:21:18 EST 2002 | stefwitt
After all, you may want to consider a Flip Chip process. The chips are bumped with tiny solder balls while still on the wafer. You may present the bumped chips in Gel Pack, trays or Surftape to your Pick $ Place machine ( if capable for Flip Chip pl
Electronics Forum | Wed Feb 15 09:00:46 EST 2006 | GS
if you look at the J-STD-033B, you will see that such a large PQFP could stay even longer the 24h at 125�C even if internally is already totally dry. It could be, the balls can get oxided and also IMC (Inter metallic compounds) could grow avery littl
Electronics Forum | Wed Dec 05 18:28:54 EST 2012 | cnotebaert
what type of part is this a micro BGA by chance? there is a mill spec (man I cant remember it right now), I'll get back to you! it provides acceptance criteria for chip/crack/gouges.... if it doesn’t expose the lead frame (inner workings of the devic
Electronics Forum | Tue Dec 19 20:01:41 EST 2000 | Lisa Murphy
Hi, I have recently been asked if I had any information on the voltage capacity of a solder ball. I asked around and did a web search but came up empty handed. Usually people are concerned with the current carrying capacity of bondwires, flip-chip
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Thu Aug 04 14:44:59 EDT 2005 | Shean Dalton
Hi Sandy B, You certainly can clean the BGA's using an inline or batch process. The correct method to hold them during this process, is the method that provides the desired outcome. I'm familiar with the desired outcome for cleaning singulated BGA
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