Electronics Forum | Sat Jul 17 17:42:02 EDT 1999 | Alain
| I have been recently playing the the different bump process within the Universal GSM part data software. Can anyone explain to me the differences between bump process A and E? Any feedback would be helpful | Hi, first of all, these were initiall
Electronics Forum | Sat Jul 17 17:42:03 EDT 1999 | Alain
| I have been recently playing the the different bump process within the Universal GSM part data software. Can anyone explain to me the differences between bump process A and E? Any feedback would be helpful | Hi, first of all, these were initiall
Electronics Forum | Sun Dec 11 22:39:36 EST 2016 | ppcbs
We have been using the Amtech line for over 12 years now with all of our PCB and BGA Rework. The NWS-4400 is mildly active and will give better results with Lead Free Solder. Note that the LF-4300 is considered a No-Clean. However it will show lea
Electronics Forum | Fri Jan 15 08:11:34 EST 1999 | Jim Nunns
Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK Regards Jim |
Electronics Forum | Wed Dec 29 15:13:29 EST 1999 | Larry Johnson
Yes, you can place BGA's with your GSM using that software. However, I don't know how critical you want to be when reading the bumps, if you want to read them at all. I did an experiment once using the same BGA, using both bump process A and E . E
Electronics Forum | Thu Dec 24 13:43:30 EST 1998 | Earl Moon
| | | Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. T
Electronics Forum | Fri Oct 11 17:05:32 EDT 2013 | hegemon
Just a thought... At that scale you might try to print paste on the devices and reflow to make bumps. That combined with your paste on the PWB might be sufficient. 'hege
Electronics Forum | Thu Aug 06 14:58:40 EDT 2009 | davef
Semiconductor fab back-ends and production contractors use laser assisted solder jetting for protoyping, repair, and other low volume flip chip bumping. * As you say, printing paste is going to be very tough to control. * Solid ball placement is ai
Electronics Forum | Sat Mar 24 05:25:07 EDT 2007 | mika
Thanks aj, Ohh I wish that there was a way to post a picture in this forum or a possibility to attach the datasheet... Which BTW does not have any recommendation of "how to". This package does not have the "center thermal pad" like a QFN or MLF pack
