Electronics Forum | Fri Oct 23 15:19:38 EDT 1998 | Dave f
| Hello : | Some of the recent FBGA (a Chip Scale Package) packages that I am looking into have body sizes having aspect ratio's 2:1. In particular, body sizes of 14x8mm, 15x8 mm etc. The ball count for this particular package is around 40-68 I/Os. M
Electronics Forum | Wed Dec 29 18:01:13 EST 1999 | JAX
What's happenin Larry, I am not sure if bump proccess E is available on this particuliar software rev. but I have forgotten?????? It shouldn't matter; bump proccess A will work fine. The only things you have to do is make sure the pick up point
Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs
For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th
Electronics Forum | Thu Aug 08 16:41:18 EDT 2002 | davef
On our last thing like that [5X5, 32, er 28?], we printed bumps on the QFN, but you can't do that, so there's no sense in tormenting you. Ideas that come to mind are: * Search around SMTnet for a paper by Chrys Shea on controlling dispense shots as
Electronics Forum | Wed Sep 29 15:45:05 EDT 1999 | Earl Moon
| | Guys thanks so much for your help I did'nt realize | | how much feedback I was going to get. I am going to | | take your advice and do a little more equipment | | research and try and find the best offer I can get | | without sacrificing equipme
Electronics Forum | Thu Apr 05 08:44:45 EDT 2007 | ck_the_flip
"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed. If that's the case, you'd have to have flux-dip capabilities on
Electronics Forum | Tue Jul 18 20:10:09 EDT 2000 | Dave F
Hey Bud: Thanks for the response the other day. We currently use "Jeff�s Method #2: The Drummel Tool." Short answer to your brother is ... yes, probably. Expanding a bit: � It would be surprising not to use a flux to help reflow the solder balls
Electronics Forum | Thu Oct 08 14:04:04 EDT 1998 | Kris Ewen
Manish, I've seen similar phenomenon when processing CSPs on our cards. In our case, we were placing the components over the opening to in-pad blind vias. Due to poor drilling and plating processes by our board suppliers, volatiles were outgassing
Electronics Forum | Sun May 31 15:57:51 EDT 1998 | Allen
I came across your question and have a good reply for you: We have been using a system to reball our BGA's made by a company called Galahad. They have been working with Hepco for distribution. Give them a call at 408-738-1880. The system is around
Electronics Forum | Fri Jul 09 16:50:25 EDT 1999 | Mark
There is a company named BGA Bumps that reconditions BGA IC's. Check out their web page www.bgabumps.com(below). As far as process specs you should look at the July 1999 issue of Circuits Assembly Magazine detailing many complex rework process and co
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