Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.
| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard
Electronics Forum | Wed Jan 12 20:20:54 EST 2000 | Bene
I had the opportunity to spend time with a demo and one on one with the inventor of the Ersa scope inhouse a few months ago. I see the scope complimenting X-ray inspection but not as a substitue. It allows you to view attributes of a solder joint t
Electronics Forum | Wed Oct 03 17:10:32 EDT 2001 | davef
Your component is probably EPTSSOP [Exposed Pad Thin Shrink Small Outline Package]. We had a thread on EPTSSOP a couple of months ago. [Check the fine SMTnet Archives for background.] You�re correct that voids in the solder on the exposed pad [rea
Electronics Forum | Wed Oct 24 11:14:44 EDT 2001 | Cemal Basaran
Dave; Thanks for responsding so fast. here are my answers. 1-WOW!!! How do people get these cool toys? I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the
Electronics Forum | Thu Jul 29 11:14:46 EDT 1999 | Justin Medernach
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Mon Sep 24 17:38:18 EDT 2001 | mparker
First question - do you have a rework station? If so, are you experiencing the same type of failures there? I have successfully used no-clean on uBGA's in the past. 6 mil solder bumps, 10 mil spacing. 88 sites. Are you reusing previously soldered uB
Electronics Forum | Fri Dec 18 22:20:41 EST 1998 | phillip hunter
| I have developing a BGA Process and having problems with | 310 IO PBGA reflowing. I am achieving good wetting exept | 2 to 5 balls on the outer perimeter I have a good profile | my air flow is set per mfg spec, the stange thing is that | it doe
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