Industry News | 2021-06-02 05:34:04.0
EasySpheres is the exclusive worldwide provider of high quality, first run solder balls at reasonable quantities and excellent prices. The company is a leading provider and technical guide to many of the solder attach and bumping challenges that customers face today.
Industry News | 2022-08-14 14:16:58.0
Test Research, Inc. (TRI) will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 4F from September 14 - 16, 2022. Visit booth #M1034 to experience the latest in Smart Factory Semiconductor Inspection.
Industry News | 2009-08-10 20:22:02.0
2@+/- 12.5µm and a 7µm Total Thickness Variation (TTV), DirEKt Coat wafer coating processes effectively address the needs of current and future thinned wafer products.
Industry News | 2023-10-31 18:47:22.0
Koh Young will highlight live demonstrations of its award-winning inspection and measurement solutions for printed circuit board, advanced packaging, and semiconductor assembly at Productronica, the highly-anticipated trade fair in Messe München on November 14-17, 2023 in Munich, Germany. Koh Young will have two booths. The first is at A2.377 and is focused on traditional surface mount technology. Our sister booth at A2.359 is focused on advanced packaging and semiconductor inspection innovations. Join our booth at Productronica 2023 to find out more. The following is just a glimpse into what Koh Young will have in store for our visitors.
Industry News | 2016-02-25 14:29:00.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-06-05 13:20:49.0
SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.
Industry News | 2015-12-14 22:14:22.0
SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature-sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
Industry News | 2015-12-16 18:10:21.0
SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature–sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
