Industry Directory | Manufacturer / Manufacturer's Representative
Sales/Marketing, Manufacturers Representatives, Used Equipment Sales
Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton
I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer
Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Used SMT Equipment | Chipshooters / Chip Mounters
Refurbished YAMAHA YS24 High Speed SMT Machine Model YS24/YS24X Applicable PCB L50xW50mm – L700xW460mm Mounting Capability 72,000CPH (0.05 sec./CHIP: Optimum conditions establish
Used SMT Equipment | Pick and Place/Feeders
Machine Type YS12F Applicable PCB L510mm x W460mm to L50mm x W50mm Mounting accuracy Absolute accuracy（μ＋3σ） +/-0.05mm/CHIP Mounting tact 20,000CPH（under our optimum condition） Component supply Tape reel, tray Number of
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Parts & Supplies | SMT Equipment
40069117 CABLE BEAR ASM 40069174 X LINEAR WAY 40069175 X BALL SCREW 40069176 Y LINEAR WAY 40069177 Y BALL SCREW 40069210 Z CYLINDER CDJPB10-15D 40069218 HEAD TUBE (ASSY) 40069219 SQUARE BLOCK 40069223 CAM FOLLOWER B 40069224 COLLAR 40069226 Z DRIVE S
Parts & Supplies | Pick and Place/Feeders
JUKI E2228725000 STOPPER FRAME FR FUJINTAI TECHNOLOGY CO.,LTD JUKI E22287250B0 STOPPER FR ASM www.fujintai.com JUKI E2228998000 DIAL GUAGE PLATE (M200) FUJINTAI TECHNOLOGY CO.,LTD JUKI E2229725000 STOPPER FRAME FL www.fujintai.com JUKI E22297250B
Technical Library | 2015-04-16 16:11:43.0
Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling, fringe projection and confocal microscopy are expensive, require complicated setup and are slow, which makes them difficult to use in a real-time manufacturing setting. Therefore, a reliable, in-line ball height measurement method is needed for inspecting units undergoing assembly. (...) In this paper, an automatic, stereo vision based, in-line ball height inspection method is presented. The proposed method includes an imaging setup together with a computer vision algorithm for reliable, in-line ball height measurement.
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
NG OK unloader is applied to PCB sorting and packing after SPI and AOI Features： Using Panasonic PLC, motor, precision ball screw Realizing sorting and packing of NG board and OK board Adjustable according to the height of the specific f
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
Career Center | SanPedro, Philippines | Maintenance,Production
Set-up Equipment machine and ensure its proper operation for costumer satisfaction. Carry out all Proactive Maintenance (PM) tasks such as predictive maintenance, preventative maintenance, failure finding maintenance and calibration maintenan
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
SMTnet Express, April 16, 2015, Subscribers: 22,628, Members: Companies: 14,302, Users: 38,055 Stereo Vision Based Automated Solder Ball Height Detection Jinjin Li, Lina J. Karam; School of Electrical, Computer, & Energy Engineering, Arizona State
KingFei SMT Tech | https://www.smtspare-parts.com/sale-37353069-n510002505aa-n510054810aa-smt-cm402-602-8-ball-spline.html
N510002505AA N510054810AA SMT Spare Parts CM402 602 8 Ball Spline Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| http://etasmt.com/cc?ID=te_news_industry,23964&url=_print
(from room temperature to 150°C) Solder paste collapse -- ramp up too fast The solvent in flux cannot vapour thoroughly, so the viscosity of the solder paste will be decreased and cause the paste collapse Soldering ball -- ramp up
