Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Thu Feb 20 17:18:24 EST 2003 | davef
Give us infortmation, please. What is [are]: * Height board to board side of the interposer on the low side of uBGA * Height board to board side of the interposer on the high side of uBGA * Alloy of solder balls, no paste was used correct? * Type of
Used SMT Equipment | Pick and Place/Feeders
JUKI KE760L / Zevatech FM760 : Completely working machine in good conditions, with some spare parts, nozzles renewed, spare mainboard/computer with LCD, manuals, etc. Supplied with 2troleys with about 70 various feeders, rack for spare feeders availa
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2014-03-28 09:54:48.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at Mandalay Bay Convention Center in Las Vegas.
Parts & Supplies | Pick and Place/Feeders
We also supply following Simens Spare parts : 00307884-01 Toothed Belt Synchroflex 16T2,5 00307922-01 BNC HF-PLUG ST 50 OHM 00308007-08 SIPLACE 80S CONTROL UNIT_ WITOUT MVS AND Y36,37 00308062-02 TRACK RULER 00308105-07 TAPE GAR
Parts & Supplies | Pick and Place/Feeders
We also supply following Simens Spare parts : 00307884-01 Toothed Belt Synchroflex 16T2,5 00307922-01 BNC HF-PLUG ST 50 OHM 00308007-08 SIPLACE 80S CONTROL UNIT_ WITOUT MVS AND Y36,37 00308062-02 TRACK RULER 00308105-07 TAPE GAR
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
) and Gold Embrittlement Conditions David Hillman and Daphne Gates Abstract 32-3 Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA
