Industry News | 2003-02-17 08:40:25.0
To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements
Parts & Supplies | SMT Equipment
ball spline if need more info about the products , pls don’t hesitate to contact with us at any time.More info pls visit our website:www.ksunsmt.com. Email: alice@ksunsmt.com Skype: alice@ksunsmt.com Whats app: +86 13170471806 MP: 0086
Used SMT Equipment | SMT Equipment
Product name: YV100XGP YAMAHA chip mounter at a moderate speed Product number: YV100XGP Products in detail YAMAHA multi-function chip mounter YAMAHA YV100XGP High speed and high precision multi-function modular placement machine 0.18 seconds/
Used SMT Equipment | SMT Equipment
Product Name: Samsung CP45FV-NEO multi-function chip mounter Product number: CP45FV-NEO Detailed product introduction Samsung CP45FV-NEO multi-function chip mounter Item: NEO CP45F/FV Visual Fly Vision (Vision+Stage) Mounting speed: Chip max sp
Used SMT Equipment | SMT Equipment
Product name: KE - 2070 high-speed chip mounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placement machine of small components. Not only the element corresponding to a wide range of laser recogniti
Used SMT Equipment | SMT Equipment
Product Name: Samsung CP45FV multi-function chip mounter Product number: CP45FV Detailed product introduction Samsung CP45FV multi function placement: Mounting head: 6 mounting head Servo system: servo motor drive X, Y shaft - Z axis shift drive
Parts & Supplies | SMT Equipment
Wiping mechanism slider (1000150) Product Name: MPM slider 1000150 SLIDE Part Number: 1000150 Description: MPM wiping mechanism slider 1000150 SLIDE Applicable models: UP; AP Printing Presses MPM wiping mechanism slider 1000150 SLIDE
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Parts & Supplies | SMT Equipment
SMT SPARE PARTS ORIGINAL NEW BALL SPLINE J6611005A for Samsung Machine Specifications: Brand Name SAMSUNG BALL SPLINE Part number J6611005A Model Ensure Test in machine confirmation Guarantee 1 month usage for machine Samsung MACHINE
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
