Electronics Forum | Tue Feb 19 11:34:04 EST 2002 | AndyC
Do you mean middle height slice ? . This is a term used to describe the x-ray taken at a mid-ball position on a BGA ball , ie , the "fattest/widest" part if the ball . This is generally done to see if voids contained within have led to fracture acros
Electronics Forum | Tue Nov 10 07:35:04 EST 2009 | scottp
Step 1 is to find out what kind of opens you're getting through a cross-section or die & pry. Are they head in pillow, brittle fracture at the intermetallic, bulk solder cracks, ball separation from interposer? Without some basic failure analysis a
Industry News | 2021-08-30 21:24:05.0
In the refrigeration system of the cold storage, the refrigeration compressor is the core equipment. At present, piston refrigeration compressors are mostly used in small and medium-sized cold storage refrigeration systems. Because of the different refrigerating mediums, the compressors are often divided into ammonia type and fluorine type. This article will introduce to you common faults and ideas of piston ammonia refrigeration compressor
Technical Library | 2020-11-09 16:59:53.0
A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
SMTnet Express, January 27, 2022, Subscribers: 25,985, Companies: 11,506, Users: 27,032 Fracture Toughness Analysis of Epoxy-Recycled Rubber-Based Composite Reinforced with Graphene Nanoplatelets for Structural Applications
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. Surface-mount boards tend to be thinner, thus having lower fracture strength. Ball grid arrays are the most frequent culprit, as moisture can lead to component warpage in addition to the other types of damage
