Parts & Supplies | Assembly Accessories
Original New Smt Spare Parts E42037060AA JUKI FTF FEEDER UPPER COVER 1604 ASM Specifications: Brand Name JUKI FEEDER UPPER COVER Part number E42037060AA Model FF161S Ensure Test in machine before shipping Guarantee Original 100% Supply a
Parts & Supplies | Chipshooters / Chip Mounters
Panasonic Bm221 H AC Motor N606hcbh-229 Hc-Bh023-S3 Basic Info Model NO.: N606HCBH-229 Type: High-speed Chip Mounter Lead Time: 2 Days Quality: 100% Tested Shipping Ways: DHL, FedEx, TNT, UPS, EMS, by Sea Trademark: PANASONIC Transport Package: Or
Parts & Supplies | Pick and Place/Feeders
We also supply following Simens Spare parts : 00304602-01 ACTUATING LEVER 00304605-01 BARCODE-STRIP LEFT SIDE 00304621S01 FLANGE 00304629-04 GUIDE FOR CHANGEABLE TABLE 00304631-03 CENTERING 00304632-05 CENTERING BOLT 003046
Parts & Supplies | Pick and Place/Feeders
We also supply following Siemens Spare parts : 00349121-02 MICRO STEP POWER OUTPUT SMC 44 00349122-01 FLAT-TAPE 12/1143 TG20 00349123-01 FLATTAPE 12/1655 TG20 00349124-01 FLAT-TAPE, 12/2460 TG20 00349189-01 I/O PCB (MIXED) KSP-P219-A32 003
Industry News | 2021-03-12 04:51:01.0
In recognition of their significant contributions of time, talent and ongoing leadership in IPC and the electronics industry, Yusaku Kono of Japan UNIX, and JonVermillion, Ball Aerospace and Technologies, were presented with IPC President's Awards at IPC APEX EXPO on March 9.
Industry News | 2011-04-01 13:21:14.0
IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Conference on Reliability: Assembly Process for a Reliable Product, November 1–2, 2011 in Irvine, Calif. Focused on reliability issues arising at the assembly level, the conference will highlight new developments in materials, process and test.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
DIP Double-side Camera Online AOI Machine ETA-V5300 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI mac
link: https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/87.html The automatic PCB magazine loader is used at the starting of the SMT production line for loading of PCBA to the line.he unit loads the production line automatically by pu
