Industry Directory: balling and specification (13)

McMahon Sales Company, Inc.

Industry Directory | Manufacturer's Representative

Consulting design and manufacturing for thru-hole and SMT PCB Designs

ARC Systems, Inc.

Industry Directory | Manufacturer / Other

ARC Systems, Inc. was founded in 1967 to provide both the military and commercial industries with a dependable source for high-precision motors and AC components.

New SMT Equipment: balling and specification (218)

Selective Conformal Coating Systems - Tilt and Rotate

Selective Conformal Coating Systems - Tilt and Rotate

New Equipment | Coating Equipment

Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000.  SimpleCoat basic model without tilt and rotate

GPD Global

Solder Training and Solder Certification Courses

New Equipment | Education/Training

Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements.  An example would be our combination type certificate t

Precision PCB Services, Inc

Electronics Forum: balling and specification (558)

Paste Flux quality specification

Electronics Forum | Tue Jul 08 06:00:29 EDT 2003 | iman

As part of our process/quality improvement review, it was raised thru' our findings that its a good mfg practice to monitor the incoming solder paste quality (as part of the indirect materials). We get one-page "outgoing QC" vendor reports with each

mask finish and solder balling

Electronics Forum | Fri Feb 19 14:43:46 EST 1999 | Nithy

We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not be

Used SMT Equipment: balling and specification (102)

Yamaha SMT YS12F Pick and Place Machine

Yamaha SMT YS12F Pick and Place Machine

Used SMT Equipment | Pick and Place/Feeders

Machine Type YS12F Applicable PCB  L510mm x W460mm to L50mm x W50mm Mounting accuracy Absolute accuracy(μ+3σ) +/-0.05mm/CHIP Mounting tact 20,000CPH(under our optimum condition) Component supply Tape reel, tray Number of

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki  KE-2070L Pick and Place Machine Specification

Juki KE-2070L Pick and Place Machine Specification

Used SMT Equipment | SMT Equipment

JUKI KE-2070L Pick and Place Machine Specification Model :KE-2070L ■ Laser mount head * 1 (6 suction nozzle) ■ PCB Board Size: L (50*30-410*360mm)   ■ Component height: 6mm ■ Component mount range:                 Laser Recognition:  0402(0100

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: balling and specification (897)

Altium CAM System and Free ODB++ Viewer Bridge Gap Between PCB Design and Manufacture

Industry News | 2003-03-11 08:45:00.0

CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.

SMTnet

Sales and Result Improved: VOGT electronic on the Right Course

Industry News | 2003-05-29 08:30:31.0

Losses halved in the first half year � New organization of electronics group next on the agenda

SMTnet

Parts & Supplies: balling and specification (229)

Juki  SMT Feeder Storage Cart For Pick and Place Machine

Juki SMT Feeder Storage Cart For Pick and Place Machine

Parts & Supplies | Pick and Place/Feeders

JUKI Feeder Storage Cart (Can be customized according to customer demand) Specification : Dimension: 800 x 600 x 1100mm, L x W x H Material:       Full Stainless Steel Structure:     2 layers, 40pieces per layer                      With fou

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha Pick and place machine

Yamaha Pick and place machine

Parts & Supplies | Pick and Place/Feeders

Product Description ·   * □ 32mm need to install special nozzle assembly ·   H15mm corresponding height ·   Identify the ball electrode ·   107 corresponds to the maximum number

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

Technical Library: balling and specification (44)

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Technical Library | 2023-01-17 17:27:13.0

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)

Heller Industries Inc.

Videos: balling and specification (259)

Cost Effective Solution for Conformal Coating

Cost Effective Solution for Conformal Coating

Videos

Cost-effective Solutions for Conformal Coating New cost-effective, automated Conformal Coating System (SimpleCoat TR) with tilt and rotate capability and excellent repeatability for just under $48,000.  SimpleCoat basic model without tilt and rotate

GPD Global

LED Pick and Place Machine

LED Pick and Place Machine

Videos

LED Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. smt machine,LED Pick and Place Machine,LED Pick and Place,led pic

Dongguan Intercontinental Technology Co., Ltd.

Training Courses: balling and specification (17)

BGA Inspection, Rework and Repair Course

Training Courses | | | PCB Inspection Courses

The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.

ACI Technologies, Inc.

Virtual Course: PCB Design for Implementing 3D and High Density Semiconductor Package Technologies

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Surface Mount Technology Association (SMTA)

Events Calendar: balling and specification (18)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

SMTA International 2020 Conference & Exhibition

Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA

SMTA International 2020 Conference & Exhibition

Surface Mount Technology Association (SMTA)

Career Center - Jobs: balling and specification (8)

Cable and Harness Assembler

Career Center | Oldsmar, Florida USA | Maintenance,Production

Job Description: • Performs a variety of tasks ranging from repetitive to non-repetitive production assembly operations on Sub-assemblies which includes installing cables and circuit card assemblies. • Ability to work from diagrams and drawings, ma

intiGrow

Soldering and Test Technician

Career Center | Orlando, Florida USA | Production

Position Summary:  Build through-hole (THT) and surface mount (SMT) printed circuit board assemblies, placing components on boards per controlled parts lists, drawing documentation and quality workmanship guidelines. Position reports to:  Group Lea

Volt Workforce Solutions

Career Center - Resumes: balling and specification (5)

SMT process and equipment engineer

Career Center | BANGALORE, India | Engineering,Maintenance,Production

Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance

Process Engineer

Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support

SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.

Express Newsletter: balling and specification (554)

Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures

Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures by: Ronak Varia, Xuejun Fan; Lamar University

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne

Partner Websites: balling and specification (2068)

Mitigating and Troubleshooting Pelletizing

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/mitigating-and-troubleshooting-pelletizing

. In order to maximize line performance and quality, we need to pay particular attention to the performance specification. UWPs are the most versatile form of thermoplastic pelletizer, but too often they are treated as a general purpose tool

ASYMTEK Products | Nordson Electronics Solutions


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used smt parts china

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Blackfox IPC Training & Certification

Component Placement 101 Training Course
Voidless Reflow Soldering

Stencil Printing 101 Training Course
High Throughput Reflow Oven

Wave Soldering 101 Training Course
SMT feeders

Software for SMT placement & AOI - Free Download.
PCB Depanelizers

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