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Signal Transmission Loss due to Copper Surface Roughness in High-Frequency Region

Technical Library | 2015-04-30 20:17:03.0

Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So, signal transmission loss of copper wiring on a printed circuit board has been studied. First, total signal loss was divided into dielectric loss and conductor loss quantitatively based on electromagnetic theory. In particular, the scattering loss due to surface roughness of copper foil has been examined in detail. And the usefulness of the copper foil with low surface roughness has been demonstrated.

Mitsui Kinzoku Group

KappAloy15 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

KappAloy15 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

New Equipment | Solder Materials

KappAloy15™ - 85%Sn - 15%Zn – has a wider plastic range of 390°F - 500°F (199°C - 260°C). This makes it ideal for hand soldering Aluminum plates and parts, allowing manipulation of the parts as the solder cools. KappAloy™ Tin-Zinc solder is designe

Kapp Alloy & Wire, Inc

KappRad - The Radiator Repair Solder

KappRad - The Radiator Repair Solder

New Equipment | Solder Materials

KappRad has been developed specifically to join and repair Aluminum and Aluminum Copper radiators and heat exchangers. A lower melting point makes delicate repair work easier. Matching KAPP Golden Flux acts as a temperature guide to ensure simple app

Kapp Alloy & Wire, Inc

KappaTinning Compound- Pre-tinning cast Iron, Steel, Bronze and Copper bearing shells.

KappaTinning Compound- Pre-tinning cast Iron, Steel, Bronze and Copper bearing shells.

New Equipment | Solder Materials

KappaTinning Compound is a dry mixture of pure powdered Tin and flux specifically designed for pre-tinning cast Iron, Steel, Bronze and Copper bearing shells. A one pound container of KappaTinning Compound contains about twice as much Tin and goes fu

Kapp Alloy & Wire, Inc

Kapp Golden Flux for Soldering Aluminum to Aluminum and Copper

Kapp Golden Flux for Soldering Aluminum to Aluminum and Copper

New Equipment | Solder Materials

Kapp Golden Flux™ has been designed specifically for soldering Aluminum to Aluminum, Copper, and Stainless Steel. Kapp Golden Flux™ is a golden colored, Chloride-Free, organic-based flux containing 56-60% active ingredients. It is a liquid consisting

Kapp Alloy & Wire, Inc

Desoldering Braid / Wick

Desoldering Braid / Wick

New Equipment | Rework & Repair Equipment

Desoldering braid (wick) is copper braid used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics. Electronic components are often mounted on a circuit board and careful desoldering of components results i

EasyBraid Co.

Wire Stripping Machine

Wire Stripping Machine

New Equipment | Cable & Wire Harness Equipment

2019 Newest Copper Wire Stripping & Cutting Machine With High Quality Feature : 1.Automatic stripper for electronic wire, silicon wire, Teflon wire, glass fiber wire, isolation wire etc. 2.automatic cutting,stripping, half stripping, middle str

Shenzhen Oubel Technology Co.,Ltd

Z-Crown Group International Ltd.

Industry Directory | Manufacturer

Z-Crown Group Network Co., Ltd. is located in Shenzhen city, Guangdong Province, China. It's a professional networking products manufacture.Producing & processing Cables ,Accessories,Equipments. Main

KappZapp4 - Tin Silver Solder for Stainless Steel to Stainless Steel and Copper - NSF 61 Certified

KappZapp4 - Tin Silver Solder for Stainless Steel to Stainless Steel and Copper - NSF 61 Certified

New Equipment | Solder Materials

The KappZapp4 - 4% Silver formula is often preferred for hand soldering Stainless and Copper parts. It has a wider slushy or plastic range to allow users to manipulate parts during cooling. Low melting temperatures prevent loss of properties and mi

Kapp Alloy & Wire, Inc

Copper Electroplating Technology for Microvia Filling

Technical Library | 2021-05-26 00:53:26.0

This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster, smaller and higher performance communication and electronic devices, build-up technology incorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiring density, reduced line widths, smaller through-holes and microvias are all attributes of these High Density Interconnect (HDI) packages. Filling the microvias with conductive material allows the use of stacked vias and via in pad designs thereby facilitating additional packaging density. Other potential design attributes include thermal management enhancement and benefits for high frequency circuitry. Electrodeposited copper can be utilized for filling microvias and provides potential advantages over alternative via plugging techniques. The features, development, scale up and results of direct current (DC) and periodic pulse reverse (PPR) acid copper via filling processes, including chemistry and equipment, are described.

Rohm and Haas/Advanced Materials


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