Industry News | 2012-08-28 09:54:11.0
Count On Tools Inc., announces a breakthrough in custom nozzle engineering for ultra-smooth components from the semiconductor market.
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Parts & Supplies | Pick and Place/Feeders
JUKI FEEDER part E513070600B E9630729000 T AC SERVO MOTOR(TS4632N2020E600) E9630755000 RERAY UNIT E96307800A0 HEAD SENSOR ASM E963171500A DUCT (KD-76-03-C) E963171500B DUCT (KD-76-045-C) E963171500C DUCT (KD-76-085-C) E9631721000 LAHD SENSOR
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Parts & Supplies | Pick and Place/Feeders
JUKI FF 44MM feeder tape guide E72037060AC E9630729000 T AC SERVO MOTOR(TS4632N2020E600) E9630755000 RERAY UNIT E96307800A0 HEAD SENSOR ASM E963171500A DUCT (KD-76-03-C) E963171500B DUCT (KD-76-045-C) E963171500C DUCT (KD-76-085-C) E96317210
Parts & Supplies | Circuit Board Assembly Products
Vacuum Ejector PN 40001266 MPS V8X-AG-0.3B-JU for JUKI KE 2060 JUKI KE2060 EJECTOR 40001266 C-0023-MCX,MPS-V8,V8X-AG-0.3B-JU JUKI E2013755000 CARRIER JUKI E2013760000 SLIDE STOPPER X1 JUKI E20138020A0 CLAMP SHAFT SUPPORT B COMPL. JUKI E20
Industry News | 2003-09-11 16:50:12.0
The printed circuit board industry is an ever-changing marketplace. The technologies of today certainly aren�t standing still, and neither should today�s PCB designer
Industry News | 2012-06-01 09:09:55.0
Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4x4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP soldering defect.
Used SMT Equipment | Pick and Place/Feeders
Make: Assembleon Model AX-501 Details:1High Output Rate: The AX-501 has a maximum output rate of 165,000 components per hour, and 121,000 components per hour under the IPC 9850 standard.2.High Precision: Placement accuracy is 40 microns at 3 sigma wi
Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
Chip assembly? Classic SMT placement? Our SIPLACE CA can do both. The SIPLACE CA is the world's first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production
New Equipment | Board Handling - Storage
Conductive Nestable Durable CP Kitting Trays offer versatile in-plant handling & storage for static sensitive components. CCI vacuum forms the trays from durable .090 mil conductive plastic. Die-cut-drop-in covers available for sizes indicated
