_1.jpg)
Parts & Supplies | Pick and Place/Feeders
JUKI FF 44MM feeder tape guide E72037060AC E9630729000 T AC SERVO MOTOR(TS4632N2020E600) E9630755000 RERAY UNIT E96307800A0 HEAD SENSOR ASM E963171500A DUCT (KD-76-03-C) E963171500B DUCT (KD-76-045-C) E963171500C DUCT (KD-76-085-C) E96317210
Parts & Supplies | Circuit Board Assembly Products
Vacuum Ejector PN 40001266 MPS V8X-AG-0.3B-JU for JUKI KE 2060 JUKI KE2060 EJECTOR 40001266 C-0023-MCX,MPS-V8,V8X-AG-0.3B-JU JUKI E2013755000 CARRIER JUKI E2013760000 SLIDE STOPPER X1 JUKI E20138020A0 CLAMP SHAFT SUPPORT B COMPL. JUKI E20
Industry News | 2003-09-11 16:50:12.0
The printed circuit board industry is an ever-changing marketplace. The technologies of today certainly aren�t standing still, and neither should today�s PCB designer
Industry News | 2012-06-01 09:09:55.0
Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4x4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP soldering defect.
New Equipment | Board Handling - Storage
Conductive Nestable Durable CP Kitting Trays offer versatile in-plant handling & storage for static sensitive components. CCI vacuum forms the trays from durable .090 mil conductive plastic. Die-cut-drop-in covers available for sizes indicated
Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
EPI offers assembly services for very complex boards and specialized manufacturing capability to fulfill Bare Die Direct, Flip Chip and Multi-Chip-Module requirements. EPI also has all military certifications from the Defense Electronics Supply Comma
Industry Directory | Consultant / Service Provider / Manufacturer
Tape Splicer for splicing SMD Carrier Tapes, including Paper and Pocket Tapes. SMD Splicing Tapes for 8mm - 24mm carrier tapes. Adhesive Back Die Carrier Tapes for Bare Dies and Flip Chips. SMT Carrier Tape Feeders.
Our DA150 series are solvent-free and fast cure thermosetting electrical and thermal conductive die attach adhesives. DA150 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. Both dispense and printin
