Full Site - : bare die tray (Page 4 of 24)

TopLine Dummy Components

Industry Directory | Manufacturer

TopLine has the widest selection of daisy chain test packages and practice boards. In stock CCGA, BGA, CSP, QFP, and test vehicle boards. TopLine is your one stop shop for mechanical samples.

Impact of FPC Fabrication Process on SMT Reliability

Technical Library | 2013-12-05 17:09:03.0

The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.

Starkey Hearing Technologies

EMS International Corporation

Industry Directory | Manufacturer

What we do: PCB Layout, Bare PCB, PCB Assembly, Component Sourcing, Molding, Enclosure, Connector, Cable, EMI Shield, Plastic Electronic product, Hardware Electronic product, PCMCIA, CardBus

Hover-Davis

Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer

Celebrating 30 years of automation technology development and innovation, Hover-Davis develops and manufactures premium, maintenance-free component and material feeders for a wide range of electronics assembly and automation.

STI Capabilities

STI Capabilities

Videos

The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to

STI Electronics

HEPCO 6500-1 Universal Lead Forming & Cutting Machines

HEPCO 6500-1 Universal Lead Forming & Cutting Machines

New Equipment | Lead Forming

Heavy-Duty Universal Lead Cut & Form Machines One Machine Does it All: TO-247, TO-126, CKO, TO-237, HALL CELL, TO-92, TO-18, TO-5 LED, TO-220, TO-202, TO-218 Hand-Feed, Tube-Feed, Bowl-Feed SIMPLE TO OPERATE: Timed Dual Pneuamtic Cylinder Actua

HEPCO, Inc.

InnospeXion ApS

Industry Directory | Manufacturer

Development and manufacturing of X-ray based inspection systems.

Vestal Electronic Devices, LLC

Industry Directory | Manufacturer

Tape & Reel, Axial Sequencing, Die Sorting, Custom Through-hole Component Forming, Jumper wires.

Fuji CP743E/CP643/XP241/GL541E

Fuji CP743E/CP643/XP241/GL541E

Used SMT Equipment | SMT Equipment

  3 lines is available for immediate sale!   All machines is in good working condition, still in production mode:-                Line #1   1. Bare board Loader - 2001   2 .MPM UP 2000  Auto Screen Printer - 1999   3. FUJI C

Automation Equipment Pte Ltd

Photonic Flash Soldering on Flex Foils for Flexible Electronic Systems

Technical Library | 2021-11-03 16:49:59.0

Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.

NovaCentrix


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High Throughput Reflow Oven
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High Resolution Fast Speed Industrial Cameras.
thru hole soldering and selective soldering needs

Software for SMT placement & AOI - Free Download.
SMT feeders

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.