Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
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What we do: PCB Layout, Bare PCB, PCB Assembly, Component Sourcing, Molding, Enclosure, Connector, Cable, EMI Shield, Plastic Electronic product, Hardware Electronic product, PCMCIA, CardBus
New Equipment | Assembly Services
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
China ISO factory of emi rf shielding can emi shielding cover for PCB board Various material available :SPTE ,Nickel silver ,Copper etc.... 5 days for prototype 7-15 days for progressive die Tape reel , plastic tray Any RFQ please send mail t
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Celebrating 30 years of automation technology development and innovation, Hover-Davis develops and manufactures premium, maintenance-free component and material feeders for a wide range of electronics assembly and automation.
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
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Development and manufacturing of X-ray based inspection systems.
SIPLACE D1 � Flexible Placement Machine With the flexible end-of-line machines SIPLACE D1 and SIPLACE D1s the SIPLACE team completes the new SIPLACE D-Series generation. The new placement machines can be alternatively equipped with one (SIPLACE D1s)
New Equipment | Tape and Reel Services
Syagrus Systems specializes in high mix low volume surface mount device (SMD) tape and reel packaging to support component distributors and OEM's. We offer the highest quality SMD tape and reel services available, and at lower costs than most compani
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