Industry News | 2016-03-07 14:06:37.0
Market Leader AdoptSMT will showcase at SMT 2016 in Hall 7, Stand No. 7-100 an array of new innovative products. These products and the service AdoptSMT offers their customers make AdoptSMT’s slogan become true: We keep your production running. AdoptSMT covers the processes of PCB assembly, hand soldering and industrial identification.
Industry Directory | Manufacturer's Representative
Manufacturers Representatives for SMT Equipment and Materials serving Southern California and Baja, MX
Tape Splicer, Splicing Tape, Tape Splicer, Splice Tape for splicing carrier tapes, mag-d electronics, magdelectronics, mag-delectronics, mag-d, mag d electronics, mag d, Surface mount feeders for bare dies and flip chips, Tape splice and splice tape
Tronixlink's Electronic Contract Manufacturing Service (EMS) PCBA layout Prototype builds Printed Circuit Board Assembly (PCBA) - Single sided , Double sided , Multilayer, Backplanes, Industrial Power boards, Wire Wrap boards, Fine-line , Analog ,
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
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Parts & Supplies | SMT Equipment
Panasonic AI Parts AV131 N210028286AA BENDING DIE Our company is professional Supplier & Manufacturer of SMT(Surface Mount Technology） Spare Parts ,if you have any needs,please contact us in these ways: ZK Electronic Technology Co., Limited
New Equipment | Assembly Services
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
Industry News | 2002-04-24 08:49:13.0
Alphasem Expects to Purchase Approximately $1.3 Million of Cognex's MVS 8100 Machine Vision Systems Over the Next 18 Months
Technical Library | 2014-08-14 17:58:41.0
High reliability applications for high performance computing, military, medical and industrial applications are driving electronics packaging advancements toward increased functionality with decreasing degrees of size, weight and power (SWaP) The substrate technology selected for the electronics package is a key enabling technology towards achieving SWaP. Standard printed circuit boards (PWBs) utilize dielectric materials containing glass cloth, which can limit circuit density and performance, as well as inhibit the ability to achieve reliable assemblies with bare semiconductor die components. Ceramic substrates often used in lieu of PWBs for chip packaging have disadvantages of weight, marginal electrical performance and reliability as compared to organic technologies. Alternative materials including thin, particle-containing organic substrates, liquid crystal polymer (LCP) and microflex enable SWaP, while overcoming the limitations of PWBs and ceramic. This paper will discuss the use of these alternative organic substrate materials to achieve extreme electronics miniaturization with outstanding electrical performance and high reliability. The effect of substrate type on chip-package interaction and resulting reliability will be discussed. Microflex assemblies to achieve extreme miniaturization and atypical form factors driven by implantable and in vivo medical applications are also shown.
Industry News | 2016-04-01 23:53:56.0
Ahead of SMT Hybrid Packaging 2016 (26 to 28 April 2016), Erhard Hofmann, MD AdoptSMT explains what the company is showcasing in Nuremberg.
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