Industry News | 2021-09-16 06:16:18.0
VJ Electronix, Inc. is pleased to announce that BAE Systems Inc. has been using the XQuik II to solve an industry-wide problem with the industry-standard Waffle Pack design.
Industry News | 2008-11-12 18:12:27.0
TORRANCE, CA � November 2008 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, introduces the SC-5000 tabletop ultrasonic stencil and misprint cleaner, which is part of its SAWA platform of products. The system comes complete with cleaning head, generator, foot pedal, large 32 x 32 tray and 30 foam pads.
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
Industry News | 2011-03-21 10:39:09.0
Universal Instruments is embracing the convergence era of electronics assembly with the introduction of the Innova and Innova + direct die feeders. This revolutionary technology enables the presentation of wafer-level devices to Universal's GenesisSC Platform without incurring costly packaging charges.
Industry News | 2022-03-30 14:59:52.0
YINCAE is excited to announce that we have developed DA158N die attach materials which is thermal conductive and electrical insulating adhesives. It can be fast cured at low temperature. The development of DA 158N is preparing the materials for people to live in the Mars.
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
Industry News | 2010-03-08 17:13:54.0
MARTIN, a FINETECH company, has appointed Scott Rushia as Sales Manager for the U.S., Canada and Mexico. In his new role, Rushia is responsible for sales and service for Martin’s rework and dispensing products.
Industry News | 2010-05-21 13:26:39.0
Televés invested once again in a new SMT production line consisting of the latest SIPLACE SX2 and SIPLACE CA machines
Automatic, High Accuracy Desktop Wafer Inspection For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive inspection of sur
Industry News | 2017-07-07 17:15:03.0
Carlsbad, CA – July 7, 2017: Machine Vision Products (MVP) today announced it would be demonstrating its Die Wire Metrology System (DWMS) and Semiconductor Automated Optical Inspection solutions at the Semicon West exhibition. These latest capabilities are available on MVP's 2020 and 850G Platforms. Applications demonstrated will include die wire metrology, wire bond, wafer and surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 11-13, 2017. Machine Vision Products are exhibiting at booth #7724 in the West Hall (Level 1).
