JUKI Large IC Tray Feeder SMT Feeder JUKI feeder JUKI Large IC Tray Feeder Usage: JUKI pick and place machine Product description: JUKI Large IC Tray Feeder INQUIRY JUKI Large IC Tray Feeder Machine Details: JUKI Large IC Tray Fe
Used SMT Equipment | Pick and Place/Feeders
The machine has barely been used since purchased in late 2017. At most, it has an estimate of 10 hours up time since then and has been powered off since 2019. The machine is located in Switzerland. LE40V220: Benchtop Auto Pick & Place / Visio
Technical Library | 2014-08-14 17:58:41.0
High reliability applications for high performance computing, military, medical and industrial applications are driving electronics packaging advancements toward increased functionality with decreasing degrees of size, weight and power (SWaP) The substrate technology selected for the electronics package is a key enabling technology towards achieving SWaP. Standard printed circuit boards (PWBs) utilize dielectric materials containing glass cloth, which can limit circuit density and performance, as well as inhibit the ability to achieve reliable assemblies with bare semiconductor die components. Ceramic substrates often used in lieu of PWBs for chip packaging have disadvantages of weight, marginal electrical performance and reliability as compared to organic technologies. Alternative materials including thin, particle-containing organic substrates, liquid crystal polymer (LCP) and microflex enable SWaP, while overcoming the limitations of PWBs and ceramic. This paper will discuss the use of these alternative organic substrate materials to achieve extreme electronics miniaturization with outstanding electrical performance and high reliability. The effect of substrate type on chip-package interaction and resulting reliability will be discussed. Microflex assemblies to achieve extreme miniaturization and atypical form factors driven by implantable and in vivo medical applications are also shown.
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
Industry News | 2010-04-29 08:33:15.0
SIPLACE CA combines die-bonding and SMT placement to meet current trends in packaging of integrated circuits
Industry News | 2012-06-22 16:48:17.0
Juki Automation Systems, Inc.recently participated in Juki’s 25,000th machine shipped celebration held in conjunction with the JISSO PROTEC 2012 exhibition, which took place June 13-15, 2012 at the Tokyo Big Sight in Japan
Highly Accurate Fully Automatic Wafer Inspection with Handling Unit For semiconductor assemblies, the requirement for a precise, thorough inspection for damage and defects during the production process is especially high. Wafers need non-destructive
Used SMT Equipment | Soldering - Reflow
Vitronics XPM2-1030 Lead-Free Reflow Oven Multiple Units Available. Factory Closure - www.xlineassets.com SMT Line #1 2006 MPM Speedline Accela Screen Printer 2007 Universal Advantis AC-30 4983A 2007 Universal Advantis AC-30 4983A 2016 Bro
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Parts & Supplies | SMT Equipment
Panasonic AI Parts N210056710AA Outside Moving Blade Our company is professional Supplier & Manufacturer of SMT(Surface Mount Technology） Spare Parts ,if you have any needs,please contact us in these ways: ZK Electronic Technology Co., Limit
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Parts & Supplies | SMT Equipment
Panasonic AI Parts N210056711AA Inside Moving Blade Our company is professional Supplier & Manufacturer of SMT(Surface Mount Technology） Spare Parts ,if you have any needs,please contact us in these ways: ZK Electronic Technology Co., Limite
