Full Site - : bare on (Page 2 of 8)

Gerry Partida, Summit Interconnect, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th

Industry News | 2017-08-06 19:39:48.0

The SMTA Capital Chapter is pleased to announce that Gerry Partida of Summit Interconnect, will present “Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.

Surface Mount Technology Association (SMTA)

Shannan O’Shaughnessy, GVD Corporation, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24

Industry News | 2017-08-14 18:22:34.0

The SMTA Capital Chapter is pleased to announce that Shannan O’Shaughnessy of GVD Corporation, will present “Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.

Surface Mount Technology Association (SMTA)

NPI back on Schedule after ECO

Industry News | 2008-01-21 13:24:32.0

Additive ECO process on bare PCB saves weeks

Additive Circuits, Inc.

Kyzen Wins Six Awards on Two Continents

Industry News | 2009-04-23 20:39:41.0

NASHVILLE � April 2009 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it has won a remarkable six awards on two continents during the last year.

KYZEN Corporation

Impact of Covid-19 on Electronics Supply Chain

Industry News | 2020-04-29 07:26:56.0

Since the 'normal life' as we know it, has been interrupted by Coronavirus pandemic, we have noted the following;

Assel

Now Available: Placing Force Measurement Option on FLX2011

Industry News | 2012-03-30 13:42:24.0

New technologies such as package on package (PoP) component assembly or bare die assembly on COB applications, as well as the optimization of material consumption demands for increased knowledge of the actual placement forces.

ESSEMTEC AG

STG Launches New Web Portion on Redesigned ECT Website

Industry News | 2008-05-23 18:28:24.0

Pomona, CA - May 22, 2008 - Everett Charles Technologies (ECT) Semiconductor Test Group (STG) announces its recent release of a new web portion, functioning as part of the redesigned ECT website, located at www.ectinfo.com/stg/.

Everett Charles Technologies

Valor’s DFM Solution Is Now Available on a Subscription Basis

Industry News | 2009-08-12 16:29:06.0

RANCHO SANTA MARGARITA, CA — August 2009 — Valor Computerized Systems, Inc., a global provider of productivity improvement software across the printed circuit board manufacturing supply chain, announces its industry-leading DFM solution now is available on a cost-effective subscription basis.

Valor Computerized Systems

Photonic Flash Soldering on Flex Foils for Flexible Electronic Systems

Technical Library | 2021-11-03 16:49:59.0

Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.

NovaCentrix

Impact of FPC Fabrication Process on SMT Reliability

Technical Library | 2013-12-05 17:09:03.0

The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.

Starkey Hearing Technologies


bare on searches for Companies, Equipment, Machines, Suppliers & Information

Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Manufacturer

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411

2024 Eptac IPC Certification Training Schedule

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Sell Used SMT & Test Equipment

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
thru hole soldering and selective soldering needs

Software for SMT placement & AOI - Free Download.
High Throughput Reflow Oven

High Throughput Reflow Oven
PCB Handling Machine with CE

World's Best Reflow Oven Customizable for Unique Applications