Industry News | 2008-01-21 13:24:32.0
Additive ECO process on bare PCB saves weeks
Industry News | 2009-04-23 20:39:41.0
NASHVILLE � April 2009 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it has won a remarkable six awards on two continents during the last year.
Industry News | 2020-04-29 07:26:56.0
Since the 'normal life' as we know it, has been interrupted by Coronavirus pandemic, we have noted the following;
Industry News | 2012-03-30 13:42:24.0
New technologies such as package on package (PoP) component assembly or bare die assembly on COB applications, as well as the optimization of material consumption demands for increased knowledge of the actual placement forces.
Industry News | 2008-05-23 18:28:24.0
Pomona, CA - May 22, 2008 - Everett Charles Technologies (ECT) Semiconductor Test Group (STG) announces its recent release of a new web portion, functioning as part of the redesigned ECT website, located at www.ectinfo.com/stg/.
Industry News | 2009-08-12 16:29:06.0
RANCHO SANTA MARGARITA, CA — August 2009 — Valor Computerized Systems, Inc., a global provider of productivity improvement software across the printed circuit board manufacturing supply chain, announces its industry-leading DFM solution now is available on a cost-effective subscription basis.
Technical Library | 2021-11-03 16:49:59.0
Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
Technical Library | 2015-09-23 22:08:32.0
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment.
Industry News | 2008-10-13 01:02:13.0
October 2008 � atg Luther & Maelzer GmbH, in cooperation with the Capital Equipment Group (CEG) of Everett Charles Technologies introduces a test protocol called ''4-wire (Kelvin)''. The 4-wire-test has long been a selectable option in the newest flying probe testers from atg-LM, A6 and A5 models.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
