Electronics Forum | Fri Mar 25 10:50:01 EDT 2011 | grahamcooper22
3 deg / sec) then the flux can slump from the paste and solder is carried with it off the pad and will form balls. Finally, are your pcbs dry ? Pass a bare one through the reflow oven before you print any paste on it, let it cool and then process as
Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef
Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Mon Jun 11 17:14:13 EDT 2012 | mmjm_1099
1st Question I am working on ROI for a bare board destacker and wondering if anyone has a general guideline to follow. Example of ROI for bare board destacker I have now as follows: $7500 for destacker, Avg panel input 3365, Time to load in panel 7
Electronics Forum | Thu Apr 12 17:34:05 EDT 2007 | carsan
We are running RoHS compliant & non RoHS compliant assemblies. We buy our bare boards from one supplier that only manufactures RoHS compliant boards using a Sn100 finish. Is there any known issues running leaded solder on a Tin finish? Does normal
Electronics Forum | Thu Aug 31 14:27:23 EDT 2000 | Travis Slaughter
How to clean a contaminated board would depend on what it�s contaminated by, alcohol may be just the thing. If there is bare copper that has corroded that could be more of a problem, or maybe not if its due to poor tinning by the board house you coul
Electronics Forum | Wed Nov 01 08:55:05 EST 2006 | russ
See if the solder is leaving the pad(s) and is wicking up the component. This is long shot but I have seen something similar to this possibly in a wave process. We had a very thin board and a very large QFP on top. During wave operation the solder
Electronics Forum | Sun Apr 15 18:06:16 EDT 2007 | greg york
You may need slightly longer dwell times and a little more heat in the reflow and wave to ensure proper alloying/wetting. Also consider if you are using a nickel doped and high copper alloy on bare boards in Leaded wave solder bath you will pick up c
Electronics Forum | Mon Jun 13 09:43:11 EDT 2011 | mosborne1
Delamination almost always is caused by moisture in the PCB. You can try to keep some of the PCBs in a dry box after recieving them. You can also slowly heat them up to bake out moisture. If you are purchasing boards form overseas form a board house
Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef
IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th
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