Electronics Forum | Fri Nov 22 08:57:56 EST 2002 | davef
Q1: What do you mean by "if the board is manufactured properly"? A2: If the epoxy is noy cured prooperly, for instance, the copper will not be well attached to the glass. So, peel strength will be lower. Q2: I don't believe that the peel off/or lif
Electronics Forum | Wed Nov 20 21:04:15 EST 2002 | yngwie
Hi Dave, What do you mean by "if the board is manufactured properly". If the board is not manufactured properly, humidity will have an impact on the peel strength? Is that what you mean. How does the Humidity impacted the peel strength ? Thru' which
Electronics Forum | Fri Nov 22 10:38:30 EST 2002 | slthomas
The follwing is from the Technet archives, per IPC's Jack Crawford. I dug it up during some investigation of a supplier's issues with humidity in an Asian plant: There is support for this in IPD-HDBK-001 w/Amendment 1 Handbook and Guide to Suppleme
Electronics Forum | Tue Oct 30 21:42:32 EST 2001 | surachai
I have question about board baking after in line washing machine then I would like to know some information that ; 1) Do we need board baking after in line washing machine? Both bare board and assembly borad normally we don't bake . 2)In case of ne
Electronics Forum | Sat Apr 25 09:13:26 EDT 1998 | Earl Moon
| Hi, | A collegue of mine, working on incoming inspection | departement, asked me if I know any good standard,preferrable | on CD-ROM with high-quality images of different defects | that can be found on bare pcb`s. | I know IPC-standards, but i
Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
Electronics Forum | Tue Mar 17 10:47:56 EDT 2020 | davef
IPC-1601 covers PWB bake-out, methods for determining optimum bake time and temperature, caveats for certain PWB plating finishes, etc. IPC-1601 is to bare boards as J-STD-033 is to components
Electronics Forum | Thu Oct 26 12:27:40 EDT 2000 | Dave Cunningham
What guidelines would you suggest for an assembly house concerning the baking of bare PCB's (assume FR4) and flexes/rigid-flexes before assembly.
Electronics Forum | Mon Sep 06 20:18:37 EDT 2004 | charly
hi, we are running high mixed low volume here, and i encounter many pcb delam after reflow issue. here some doubt need ur advise: 1. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? if i allow bare
Electronics Forum | Tue Dec 09 10:04:36 EST 2008 | lazzara55
SMT-ypw: Does PWB supplier start to implement PWB drying packaging? B3: YES! The fabrication of the PCB involves a series of wet processing that requires counter-measures to remove moisure. While some of the PCB processes also include bake cycles th
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