The DX-250 Series Digital Dispenser/Controller is economical, highly accurate and repeatable micro-air dispensing system. This precision fluid dispensing system includes digital timer and vacuum control for all viscosities of fluids. Packaged ready t
The DX-350 Series offers 10 user programmable dispense routines and 4 operating modes. The time, pressure and vacuum read-outs are displayed digitally. It is intuitive to use and allows accurate reproduction of sequences of beads or dots. The DX-350
Electronics Forum | Thu Apr 30 22:40:32 EDT 2009 | davef
Selective Wave Soldering DoE to Develop DfM Guidelines for Lead and Pb-Free Assemblies Written by Makram Boulos, Craig Hamilton, Mario Moreno, Ramon Mendez, German Soto and Jessica Herrera Circuits Assembly Magazine, 31 December 2008 19:00
Electronics Forum | Tue Jun 20 21:30:05 EDT 2006 | davef
The minimum vertical hole fill is defined as follows: Class 1: Not specified, with a 270-degree circumferential fillet and wetting on the secondary (solder source side) of lead and barrel, and a 75% coverage of the land area on the secondary side. Cl
Industry News | 2010-09-30 00:35:51.0
The new E revisions of IPC’s popular desk reference manuals, IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide have been released.
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Technical Library | 2015-12-23 16:57:27.0
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.
www.techconsystems.com The TS250 Series Dispenser/Controller dispenses low, medium and high-viscosity fluids accurately and consistently. These systems are economical, highly accurate and repeatable micro-air dispensing systems. These user friendly
Fully automatic wire crimping machines for high-speed wire processing. High productivity, short changeover times, user-friendly operation and a wide range of processing capabilities from wire and cable cutting, stripping and crimping to sealing, twis
SMTnet Express, December 23, 2015, Subscribers: 23,927, Members: Companies: 14,845, Users: 39,621 PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks Edward Arthur, Charles Busa, Melissa Durfee, Chad Gibson, Wade Goldman P
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