Full Site - : barrell fill (Page 15 of 20)

Throiugh Hole pad missing after selective soldering

Electronics Forum | Wed Apr 13 12:10:47 EDT 2022 | winston_one

Hello! We have a strange effect. Some pads of big trough-hole DDR slot just dessapear. Initialy it was soldered with selective soldering process (leaded, 290 degrees, ImSn finish, very short storage). Then some connectors with poor barrel fill we hav

Throiugh Hole pad missing after selective soldering

Electronics Forum | Thu Apr 14 13:49:34 EDT 2022 | winston_one

Thank you for reply, Stephen. No, As I wrote it was leaded process. I heard that it is possible with lead free solder at higher temps an dwell time. At NPL Defect Database I've find this case wich looks exactly the same: http://defectsdatabase.npl.co

VOC free flux

Electronics Forum | Wed Apr 27 08:19:41 EDT 2011 | charliedci

We are in the process of changing over our wave solder flux from alcohol based no clean to VOC free water based no clean. We are running an old Eletrovert with foam fluxer, tin lead solder. After preliminary testing on scrap boards and now starting t

Lead free selective solder

Electronics Forum | Thu Jun 29 12:07:09 EDT 2017 | georgetruitt

HOW THICK IS THE BOARD? IS THERE A LOT OF COPPER IN THE BOARD? DOES YOUR CUSTOMERS PROVIDE HEAT RELIEF IN THE BOARDS BARREL DESIGN THERE NEEDS TO BE PLENTY OF ROOM FOR LEADFREE SOLDER TO FLOW, DID YOU CHECK YOUR PIN(LEAD)TO HOLE (BARREL) RATIO? N

Intrusive reflow soldering

Electronics Forum | Fri Feb 21 19:41:25 EST 2003 | neil

I have had a look at what Bob Willis say's and the answer to my problem is not there. The paste we are using has a very high viscosity and I beleive that if we reduce the metal content to less than 90% it will solve the problem. The problem is parti

Dry solder

Electronics Forum | Wed Jan 11 11:52:50 EST 2017 | emeto

First, why do you have paste on the opposite side of the component. I would recommend having it on the same side. Second, how thick is your stencil? Pin in paste requires thickness, to fill the whole barrel. Stencil should be really thick. Try to man

Re: flow thru

Electronics Forum | Tue Nov 02 17:52:17 EST 1999 | Dave F

Jim: Several points: 1 If you�re correct about corrosion of your component leads (which is entirely possible if the leads are steel, as you say), then the AIM 264-5 no-clean may not be aggressive enough to remove the corrosion you are seeing routin

Wave Soldering Ceramic PCB's

Electronics Forum | Wed Aug 08 21:18:15 EDT 2001 | davef

Get-out the razor blades, bud. You could run that sukka for 6 sec dwell, cook breakfast on it, and you still will not get fill. [Hole file that is, breakfast will go along ways if peckish, though.] You could fire-up the depleted ozone rework gun [

Solder Wave

Electronics Forum | Thu Aug 11 21:43:19 EDT 2005 | Ken

Those temp stickers are useless unless you can stick them into the copper barrel. They can only determine "skin" temperature which has nothing to do with what is happening in the barrels. Your solder is filling the barrel then going cold. I'll gua

Printing micro-vias for BGA placement

Electronics Forum | Fri May 10 14:02:05 EDT 2002 | pjc

First off what bone-head designer put them there in the first place. Vias in solder lands is a big time no no. I had this problem at a CEM I worked at. I had the customer change the design but had to run the 6 samples they supplied. I ended up fillin


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