The SP700avi stencil printer combines Speedprints commitment to high performance and reliability with outstanding value. The system has been designed to cope with the rigors of high volume SMT production whilst incorporating the flexibility needed in
Industry News | 2010-03-22 14:33:44.0
Pomona, CA, March 2010 — Everett Charles Technologies (ECT) Contact Products Group (CPG) will feature the latest electrical test technologies in booth 1283 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Industry News | 2020-05-12 11:53:28.0
Precision Assembly Technologies, Inc. (P.A.T.), based in Bohemia, NY, was seeking a system that could dispense specific solder beads within a component and place the die into position within a housing. The Essemtec FOX2 multi-function combined pick-and-place and dispensing system provided the solution.The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.
SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging
Industry News | 2009-11-11 12:17:30.0
San Diego — November 2009 — KIC announces that it has been awarded a Global Technology Award in the category of Solar Manufacturing Products for its e-Clipse solar cell thermocouple (TC) attachment fixture. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2010-04-11 02:18:14.0
San Diego - KIC announces that it has been awarded an NPI Award in the category of Process Control Tools for its e-Clipse solar cell thermocouple (TC) attachment fixture. The award was presented to the company during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.
Industry News | 2014-06-17 21:50:29.0
SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.
Industry News | 2015-08-20 12:02:27.0
Graco will highlight its new InvisiPac® GM100 Plug-Free™ Hot Melt Applicator and LineSite™ Remote Monitoring Solution at Pack Expo 2015. The GM100 offers all the benefits of plug-free adhesive dispensing in a compact design, while LineSite reduces adhesive costs and boosts production in packaging industry applications through remote system monitoring.
Industry News | 2019-04-15 07:11:46.0
PVA will exhibit at SMTconnect, scheduled to take place May 7-9, 2019 at the NurnbergMesse GmbH in Nuremberg, Germany. Company representatives will showcase the Delta 8 selective coating/dispensing system and Delta 6 robotic conformal coating/dispensing system in Hall 4, Stand 460.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
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