Industry Directory | Manufacturer
Langfang Olan Glass Beads Co., Ltd is the professional glass beads manufacturer in China. It has advanced production technology and managerial experience, which is also the leading exporter of glass beads.
Industry Directory | Manufacturer
Manufacturer of Ferrite Chip Beads and Arrays, Ferrite Power Beads, Ceramic Inductors, and Ferrite Inductors.
Seam welding bead can be heat welded to ESD control vinyl tile for design purposes or to create a functionally seamless, waterproof floor. The benefits can be seen in improved floor durability and sanitation maintenance, as well as enhanced floor ap
Electronics Forum | Mon Mar 20 22:39:03 EST 2006 | davef
Pavel Point: You suspect that solder paste can easily get to solder mask causing beading, because the aperture is larger than the component pad. Comment: Probably, this is incorrect. We overprint on solder mask all day long when doing paste-in-hol
Electronics Forum | Tue Mar 21 08:22:11 EST 2006 | jdengler
If you usually get good release on other products with your paste, I would try a different batch of paste. The batch you are using may have a problem that contributes to the beading. Jerry
Used SMT Equipment | Screen Printers
Vintage: 12/2011 Details • Automated Paste Dispenser • GridLoc System • Laser Paste Bead Height Sensor • Contrast Based 2D Inspection (paste on pad)- • Triple Track Conveyor System (66" Track Length). With Servo Driven Vision X, Y
Used SMT Equipment | Pick and Place/Feeders
Machine size: length 1500 * width 2000 * height 1500 (unit: mm) Machine structure: 3 groups of placement heads, different nozzles can be replaced automatically Machine specifications: standard version, front loading rack and tube load
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Parts & Supplies | Assembly Accessories
FUJI Nozzle 3.7 AA20D14 Other FUJI nozzle in stock: CP6 0.4/0.7/1.0/1.3/1.8/2.5/2.8/3.0/3.7/5.0 nozzle FUJI CP6 nozzle AWPH9514 (0.7 nozzle), AWPH9524 (1.0 nozzle), AWPH9534 (1.3 nozzle), AWPH9545 (1.3 nozzle), AWPH9554 (1.8 nozzle), AWPH9563 (2.5
Parts & Supplies | Chipshooters / Chip Mounters
FUJI Nozzle 1.3 AAO6815 Other FUJI nozzle in stock: CP6 0.4/0.7/1.0/1.3/1.8/2.5/2.8/3.0/3.7/5.0 nozzle FUJI CP6 nozzle AWPH9514 (0.7 nozzle), AWPH9524 (1.0 nozzle), AWPH9534 (1.3 nozzle), AWPH9545 (1.3 nozzle), AWPH9554 (1.8 nozzle), AWPH9563 (2.5
Technical Library | 2015-08-20 15:18:38.0
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been drastically reduced (as small as 0.5 mm in diameter) but current product design parameters have created space and access limitations that remove even the option for these test points. Many high speed signal lines have now been restricted to inner layers only. Where surface traces are still available for access, bead probe technology is an option that reduces test point space requirements as well as their effects on high speed nets and distributes mechanical loading away from BGA footprints enabling test access and reducing the risk of mechanical defects associated with the concentration of ICT spring forces under BGA devices. Building on Celestica's previous work characterizing contact resistance associated with Pr-free compatible surface finishes and process chemistry; this paper will describe experimentation to define a robust process window for the implementation of bead probe and similar bump technology that is compatible with standard Pb-free assembly processes. Test Vehicle assembly process, test methods and "Design of Experiments" will be described. Bead Probe formation and deformation under use will also be presented along with selected results.
Technical Library | 2021-11-26 14:34:07.0
The use of desiccant bags filled with Silica Sand and or Clay beads used in conjunction with a Moisture Barrier Bag to control moisture for storage of printed circuit boards has long been an accepted practice and standard from both JEDEC and IPC organizations. Additionally, the use heated ovens for baking off moisture using the evaporation process has also been a long#2;standing practice from these organizations. This paper on alternative drying methods will be accompanied by completed independent, unbiased tests conducted by Vinny Nguyen, an engineering student (now graduated) from San Jose State University. The accompanied paper will examine the performance levels of different technologies of desiccant bags to control moisture in enclosed spaces. The tests and equipment set were reviewed by an engineer and consultant to the Lockheed Martin Aerospace Division and the IPC - TM-650 2.6.28 test method was review by engineer from pSemi. The tests were designed to mimic performance tests outlined in Mil Spec 3464, which both IPC and JEDEC have adopted for their respective standards. The test examined variables including absorption capacity rates, weight gain and release of moisture back into the enclosed area. The presentation will also address and highlight: • Similarities of PCBs and Heavy Equipment as it applies to Inspections, Causes of Failure, Types of Corrosion and Moisture Collection Points. • Performance Attributes of Different Desiccant Technologies as it applies to shape, texture, change outs, labeling and regeneration. • Venn Diagram of Electromechanical Failure with the circles 1. Current 2. Contamination 3. Humidity Presentation Available
4-Position Tilt Accessory for the SC-300 Conformal Coating Applicator
Rugged, fast and consistent – even with high inlet pressures Dos GP systems are the first choice for applications requiring 1C, high viscosity, unfilled, non-abrasive potting material, making them the best choice for applying continuous beads.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Mon Feb 11 00:00:00 EST 2019 - Mon Feb 11 00:00:00 EST 2019 | ,
Webinar: Solder Paste Evaluation & Simple Tricks of the Trade
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
SMTnet Express, August 20, 2015, Subscribers: 23,363, Members: Companies: 14,574, Users: 38,793 Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly John McMahon P.Eng, Tom Blaszczyk, Peter Barber; Celestica Corporation
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/about-adhesives/news-search/nordson-optibond-solution-for-package-sealing-applications-reduces-adhesive-requirements
. Replacing longer adhesive beads with more frequent, shorter, intermittent beads increases the number of beginning and end points, therefore improving bond strength
| http://etasmt.com/cc?ID=te_news_bulletin,19761&url=_print
. This is the first confirmation work in the factory quality management; 2. LED reflow soldering must read the factory specifications of the LED lamp beads before doing the soldering work, and see its various technical parameters; a
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