Industry Directory | Consultant / Service Provider / Manufacturer
Our Ultrasonic Stencil cleaners and 440-R-SMT Detergent are US & CA EPA Certified cleaners, that are environmentally and user safe. We are your single source for cleaning any type of solder paste from any fine pitch stencil.
Leading supplier of Solid Solder Deposit (SSD) technology and equipment to the electronics industry. Mask Tek's patented PPT process eliminates solder paste at assembly. Ideal for fine pitch and BGAs. Please visit our web site at masktek.com.
New Equipment | Solder Paste Stencils
Sometimes there are products that come along and you think to yourself-Wow! The StikNPeel™ rework stencil is one of those products. It simplifies the rework of site locations by placing a highly flexible, removable, adhesive-backed stencil on to a ci
New Equipment | Solder Paste Stencils
BEST custom manufactures a vareity of stencils including miniature rework stencils. These stencils are designed to rework specific component locations. These component stencils feature flaps on their sides in order to prevent solder paste form leachi
Electronics Forum | Sat Aug 21 02:27:21 EDT 2010 | isd_jwendell
The paste you dispense will not solder the same as the one you use with a stencil. The paste for the stencil will have a higher metal content. I was not working with dispensing as small as you are, but after evaluating the cost of the stencil vs. lon
Electronics Forum | Thu Jun 16 22:14:51 EDT 2005 | davef
16 thou pitch parts: Use a 5 thou laser cut electropolished stencil with 0.008"x0.045" apertures and type 3 solder paste. Bridges Connecting or Partially Connecting Adjacent Leads or Lands * Excessive solder paste * Excessive component placement pre
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2008-03-25 23:53:54.0
Comment from Brian D�Amico, President
Parts & Supplies | Pick and Place/Feeders
Expert-SAFP (110V/230V configurable) NEW PRICE EUR30.000,-, now for EUR 18.500 net (excl. Tax) only. Perfect for fast and reliable Prototyping. For sale is an Essemtec Expert-SAFP (110V/230V configurable). The Expert-SAFP is a professinal semi-
Technical Library | 2007-02-01 09:57:15.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.
Technical Library | 2017-03-30 18:34:52.0
There are multiple methods, each with its associated benefits for given applications, for printing either solder paste or paste flux for BGA rework. Each of these methods is best-suited for a given situation, board layout and skill level of operators performing the BGA rework. This discussion will layout the various methods and present the specific circumstances for which the specific technique is most wellsuited. In addition, the pluses and minuses for each of the approaches will be discussed in detail.
SMT is surface assembly technology, a new generation of electronic assembly technology developed from hybrid integrated circuit technology. SMT production line is also called surface assembly technology. Full-auto SMT Production Line is a new generat
SMT On-line 3D Solder Paste Inspection If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI in
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Warminster, Pennsylvania USA | Production,Quality Control
PCB component level assembly - soldering under microscope. *Soldering and mechanical assembly using excellent solder skills, manual dexterity, depth perception and attention to detail. *Perform or inspect component replacement and rework on units.
Career Center | Gwinnett County, Georgia USA | Production
SHIFTS: 1st and 2nd Shifts (Over-Time as required) STATUS: Indefinite Temporary PAY: $11.00-$12.00 per hour JOB DESCRIPTION • Perform SMT soldering, desoldering, rework, and assembly of fine pitch electronic components on Printed Circuit Boards (PCB
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
SMTnet Express, December 20, 2018, Subscribers: 31,551, Companies: 10,666, Users: 25,526 Process Optimization for Fine Feature Solder Paste Dispensing Credits: Indium Corporation With the rapid trend towards miniaturization in surface mount
SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS Chip
Lewis & Clark | http://www.lewis-clark.com/product/mydata-feeders-tm8fc-8mm-fine-pitch-magazine/
& Place Feeder carts and trolleys Press Reflow Oven Rework Station Router Screen Printer Selective Solder Service Spare-Parts SPI- Solder Paste Inspection Systems Uncategorized Wave Solder Wire Bonder X-Ray ©2018 Lewis & Clark
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/advice-for-solder-mask-paste-mask-layers_topic484_page1.html
. These are for example: 1. Solder mask defined pads under fine pitch BGA packages. 2. Multiple separated squares on the paste mask layer to create 50