Industry News | 2023-12-18 13:13:45.0
SHENMAO Technology proudly unveils its latest innovation, the PF918-P250 no-clean solder paste, specifically designed to meet the stringent demands of automotive applications. With a focus on enhancing thermal impact reliability, PF918-P250 sets a new standard for performance, delivering superior results for automotive devices and high-power components.
Industry News | 2014-09-06 15:26:20.0
FCT Assembly today announced plans to exhibit at the SMTA Capital Expo & Tech Forum, scheduled to take place Tuesday, September 9, 2014 at the John Hopkins University/Applied Physics Lab in Laurel, MD.
Industry News | 2009-10-16 19:20:15.0
GREELEY, CO — FCT Assembly announces that lab services are now offered at its Greeley, CO facility. Conventional 63/37, SN100C® lead-free and SAC305 alloys can be analyzed at the facility.
Industry News | 2013-11-14 18:14:55.0
Indium Corporation was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.
Industry News | 2014-02-27 17:02:28.0
The Balver Zinn Group announces that it will exhibit in Booth #2714 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.
Built upon latest 3D projection technology, the TR7007QI SPI offers industry leading inspection accuracy for the most demanding applications. The inline inspection system automatically optimizes the inspection route for best performance, and TRI’s in
Industry News | 2016-04-19 05:13:13.0
The Balver Zinn group announced that they will sponsoring the IPC Hand Soldering Competition at SMT Hybrid Packaging in Nuremberg-Germany, scheduled to take place April 26-28, 2016. Balver Zinn will be contributing BRILLIANT B2012 solder wire which is halide-free, rosin based and designed for manual and robotic soldering.
Industry News | 2017-05-09 04:41:07.0
The Balver Zinn group announces that they will sponsoring the IPC Hand Soldering Competition at SMT Hybrid Packaging in Nuremberg-Germany, scheduled to take place May 16-18, 2017. Balver Zinn will be contributing BRILLIANT B2012 solder wire which is halide-free, rosin based and designed for manual and robotic soldering.
Industry News | 2010-11-02 10:42:48.0
Christopher Associates today announced the US introduction of Koki’s S3X48-M500 and S3X48-M500C Printable No-Clean Lead-Free Solder Pastes. Originally designed and formulated for superior head-in-pillow performance, the pastes also exhibit exceptional wetting and printing.
Industry News | 2013-10-08 14:47:36.0
The Balver Zinn Group announces that it will exhibit in Hall A4, Stand 451 at the 20th international Productronica Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
