Industry News | 2010-12-07 15:07:35.0
Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.
Industry News | 2017-07-09 20:40:11.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2023-09-25 17:55:00.0
Indium Corporation R&D Manager, Alloy Group and Principal Research Metallurgist Dr. HongWen Zhang will present at the SMTA Empire Expo & Tech Forum on September 26 in Syracuse, NY. Also at the conference, Regional Sales Manager Emily Belfield will host a panel discussion, Generational Differences in Today's Workplace.
Industry News | 2017-07-06 09:53:39.0
SHENMAO Technology introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.
Industry News | 2024-03-18 12:19:32.0
Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Renowned for its commitment to innovation, Nihon Superior will present a range of groundbreaking products, including the SN100CV® P608 solder paste and the TempSave™ series of low-temperature soldering materials.
Industry News | 2023-09-11 17:19:08.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its SN100CV P608 solder paste in Booth #1415 at the SMTA International Exposition, scheduled to take place Oct. 10-11, 2023 at the Minneapolis Convention Center in Minneapolis, MN.
Industry News | 2019-08-12 20:00:01.0
SHENMAO America is pleased to announce that it will exhibit at the 31st Annual Electronics Packaging Symposium- Small Systems Integration, scheduled to take place Sept. 5-6, 2019 in Binghamton, NY. Watson Tseng, General Manager, SHENMAO America, will present “New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly.”
Industry News | 2008-08-07 11:19:55.0
OSAKA, JAPAN � August 7, 2008 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will present during the technical conference as well as exhibit at the upcoming SMTA International Conference & Exhibition, scheduled to take place August 17-21, 2008 at Disney's Coronado Springs Resort in Orlando, FL.
Industry News | 2022-04-06 10:13:58.0
EVS International is pleased to announce the appointment of ARK Manufacturing Solutions, LLC as its manufacturers' representative. Dave Murrin, President and principal owner of ARK Mfg., will represent EVS' solder recover systems in Arizona, New Mexico and Southern Nevada.
Industry News | 2013-06-06 19:12:21.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit Balver Zinn water-soluble LF3237 Solder Wire in Booth #44 at the upcoming SMTA Upper Midwest Expo and Tech Forum, scheduled to take place Thursday, June 27, 2013 at the Embassy Suites in Bloomington, MN
