Industry News | 2011-09-19 16:15:53.0
VJ Electronix will exhibit the new SRT Micra Rework Platform in Booth #232 at the upcoming SMTA International Conference & Exhibition.
Industry News | 2011-06-01 23:55:51.0
VJ Electronix announces that Technical Resources Corporation will have product literature available about the new SRT Micra at the upcoming Space Coast Expo and Tech Forum, scheduled to take place Thursday, June 9, 2011 at the Melbourne Auditorium in Melbourne, FL.
Industry News | 2011-11-20 13:30:54.0
VJ Electronix has been awarded a Global Technology Award in the category of Rework and Repair for its SRT Micra Rework Platform
Industry News | 2011-04-20 16:27:12.0
VJ Electronix, Inc. announces that it has been awarded a 2011 NPI Award in the category of Rework and Repair Tools for its SRT Micra Rework Platform. The award was presented to the company during a Tuesday, April 12, 2011 ceremony that took place at the Mandalay Bay Resort & Convention Center in Las Vegas during IPC APEX 2011.
Industry News | 2011-05-16 14:54:48.0
VJ Electronix announces that it has been awarded a 2011 EM Asia Innovation Award in the category of Rework/Repair Tools for its SRT Micra Rework Platform. The award was presented to the company during a May 12, 2011 ceremony that took place at the Shanghai Everbright Convention & Exhibition Center during NEPCON China 2011.
Industry News | 2011-03-28 11:42:40.0
Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of three new low cost I/O Breakout Boards: the MachXO™ 2280 Breakout Board, the ispMACH® 4256ZE Breakout Board and the Power Manager II POWR1014A Breakout Board.
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0
Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem
Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc
Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components
Electronics Forum | Tue Sep 21 13:12:56 EDT 1999 | Dave F
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | Greg: I was going to link you to the IPC land pattern c
